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LMX2346SLBX

Texas Instruments

LMX2346SLBX by Texas Instruments

LMX2346SLBX by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating at 3V. It features a ceramic, metal-sealed co-fired package and can withstand temperatures from -40 to 85°C. Ideal for industrial applications requiring precise frequency synthesis in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,193 parts In-Stock

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4,193

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Vyrian

USA . 4,117 parts In-Stock

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4,117

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Netsource Technology, Inc.

USA . 2,265 parts In-Stock

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2,265

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Anansix

USA . 1,401 parts In-Stock

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1,401

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Distributors (Availability)

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One Stop Electronics

USA . 310 parts In-Stock

1+ parts

$6.500

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310

$6.500

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Parana Technologies

USA . 629 parts In-Stock

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$12.058

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$12.465

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629

$12.058

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$12.465

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DigiPath Technology Company

USA . 2,225 parts In-Stock

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$13.277

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$12.215

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2,225

$13.277

$12.215

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IDEA Electronic Components Group

UK . 1,639 parts In-Stock

1+ parts

$13.548

100+ parts

$12.871

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$12.193

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1,639

$13.548

$12.871

$12.193

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ChromeModa Solutions

Germany . 682 parts In-Stock

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$13.548

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$11.109

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682

$13.548

$11.109

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AZTECH Wire

Italy . 706 parts In-Stock

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$18.671

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706

$18.671

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Corphita

USA . 1,819 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the LMX2346SLBX from Texas Instruments. This high-quality Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unmatched performance and reliability. Perfect for industrial applications, this chip carrier package boasts a thin profile and nickel/gold terminal finish for seamless integration. With a nominal supply voltage of 3V and a wide operating temperature range, the LMX2346SLBX delivers exceptional value and precision. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials provides excellent durability and reliability for the product, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability makes the product easy to integrate onto circuit boards, allowing for efficient and compact design layouts.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V ensures compatibility with common power sources, making it a convenient choice for various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions, ensuring reliable performance under various scenarios.

Technology: BICMOS

The use of BICMOS technology offers a balance between high-speed performance and low power consumption, making this product ideal for applications requiring efficient signal processing.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2346SLBX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-CQCC-N16

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC16,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

7.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Gold (Ni/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

LMX2346SLBX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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