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LMX2581SQE

Texas Instruments

LMX2581SQE by Texas Instruments

LMX2581SQE by Texas Instruments is a PLL & Frequency Synthesis Circuit with 32 terminals, operating at 3.3V. It has a temperature range of -40 to 85°C and comes in a square chip carrier package. Ideal for industrial applications requiring precise frequency synthesis and phase-locked loop functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,568 parts In-Stock

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6,568

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Digiode

USA . 1,117 parts In-Stock

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1,117

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Distributors (Availability)

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Parana Technologies

USA . 735 parts In-Stock

1+ parts

$1.188

100+ parts

-

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$1.990

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735

$1.188

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$1.990

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DigiPath Technology Company

USA . 1,953 parts In-Stock

1+ parts

$1.308

100+ parts

$1.204

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1,953

$1.308

$1.204

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ChromeModa Solutions

Germany . 5,115 parts In-Stock

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$1.335

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$1.095

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5,115

$1.335

$1.095

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

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$1.335

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$1.202

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1,096

$1.335

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$1.202

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

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$3.500

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1,406

$3.500

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Semicontronic

India . 562 parts In-Stock

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$5.500

100+ parts

$5.362

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$5.335

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562

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 1,423 parts In-Stock

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$6.500

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1,423

$6.500

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AZTECH Wire

Italy . 806 parts In-Stock

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$8.536

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806

$8.536

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Corphita

USA . 2,602 parts In-Stock

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2,602

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Corohmni

South Africa . 73 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality LMX2581SQE from Texas Instruments. As a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Texas Instruments delivers top-notch products that excel in performance and reliability. The LMX2581SQE, with its compact square package and wide operating temperature range, is perfect for a variety of applications. Experience the value and benefits of this advanced IC type, offering precise frequency synthesis and stability to take your projects to the next level. Choose Texas Instruments for unparalleled quality and innovation in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

The surface mount capability enables easy and efficient installation of the product on various PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V supply voltage ensures compatibility with common power sources, making integration into existing systems simpler.

No. of Terminals: 32

The ample number of terminals allows for versatile connectivity options and functionality within a circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature indicates suitability for use in both hot and cold climates.

Terminal Position: QUAD

The quad terminal position allows for efficient and organized connection within the circuit layout.

Width (mm): 5 mm

The compact width of 5 mm enables space-saving design and integration in constrained PCB layouts.

Minimum Supply Voltage (Vsup): 3.15 V

The minimum supply voltage of 3.15 V ensures stability and proper functioning of the product under varying voltage conditions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies robustness and reliability, suitable for use in harsh industrial settings.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2581SQE attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

LMX2581SQE Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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