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LMX2377USLEX

Texas Instruments

LMX2377USLEX by Texas Instruments

LMX2377USLEX by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating voltage of 2.7-5.5V, and BICMOS technology. It has a compact square chip carrier package suitable for industrial applications, with a temperature range of -40 to 85°C. This surface-mount device features a low supply current of 4.6mA and is ideal for frequency synthesis circuits requiring precise phase-locked loops.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,923 parts In-Stock

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Anansix

USA . 2,219 parts In-Stock

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Digiode

USA . 1,103 parts In-Stock

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One Stop Electronics

USA . 961 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 931 parts In-Stock

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$14.337

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$14.788

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931

$14.337

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$14.788

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ChromeModa Solutions

Germany . 2,069 parts In-Stock

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$16.109

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$13.209

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2,069

$16.109

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IDEA Electronic Components Group

UK . 741 parts In-Stock

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$16.109

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$15.304

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$14.498

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741

$16.109

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$14.498

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AZTECH Wire

Italy . 507 parts In-Stock

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$17.497

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QUARKTWIN TECHNOLOGY LTD

USA . 4,642 parts In-Stock

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Corphita

USA . 3,477 parts In-Stock

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$14.524

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Microchip USA

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Overview

Unlock the power of precision frequency synthesis with the LMX2377USLEX by Texas Instruments. Designed with cutting-edge BICMOS technology, this PLL frequency synthesizer offers unparalleled quality and reliability. From industrial applications to consumer electronics, this chip carrier package delivers exceptional performance in a compact design. With a nominal supply voltage of 3V and a maximum operating temperature of 85°C, customers can trust that their devices will operate seamlessly. Experience the benefits of superior technology and maximize efficiency with the LMX2377USLEX from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost effective and provides good thermal properties, making the product durable and reliable.

Nominal Supply Voltage (Vsup): 3 V

Optimal voltage for efficient performance and power consumption.

Maximum Operating Temperature: 85 °C

Product can operate in a wide range of temperatures, suitable for various environments.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS, providing high speed and low power consumption.

Terminal Pitch: 0.5 mm

Small pitch allows for compact design and efficient use of space on the circuit board.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2377USLEX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

SELECTABLE 32/33, 16/17 OR 8/9 PRESCALER

Other IC type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e0

Length:

3.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3.5 mm

Trade Compliance

LMX2377USLEX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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