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LMX2531LQE2820E

Texas Instruments

LMX2531LQE2820E by Texas Instruments

LMX2531LQE2820E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating voltage range of 2.8V to 3.2V, and temperature range of -40°C to 85°C. It features BICMOS technology, square package shape, and is suitable for industrial applications requiring precise frequency synthesis.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,536 parts In-Stock

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Digiode

USA . 4,004 parts In-Stock

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Anansix

USA . 1,322 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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One Stop Electronics

USA . 395 parts In-Stock

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$1.500

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Parana Technologies

USA . 839 parts In-Stock

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$2.412

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$2.908

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DigiPath Technology Company

USA . 2,031 parts In-Stock

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$2.656

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$2.443

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$2.656

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ChromeModa Solutions

Germany . 4,766 parts In-Stock

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$2.710

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$2.222

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IDEA Electronic Components Group

UK . 186 parts In-Stock

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$2.710

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$2.439

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AZTECH Wire

Italy . 312 parts In-Stock

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$11.644

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Corphita

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Overview

Unlock the potential of your electronic designs with the LMX2531LQE2820E by Texas Instruments, a cutting-edge Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Manufactured with precision and expertise by Texas Instruments, this surface mount chip offers unparalleled reliability and performance. Ideal for a wide range of applications, this PLL Frequency Synthesizer provides customers with the flexibility and accuracy needed to take their projects to the next level. Experience the quality, value, and benefits of Texas Instruments technology with the LMX2531LQE2820E.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, making this product suitable for compact and densely populated electronic systems.

Package Shape: SQUARE

Square package shape provides efficient use of space on the circuit board, enabling a more streamlined and compact design.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard supply voltage of 3V, making it compatible with a wide range of electronic devices and power sources.

No. of Terminals: 36

With a high number of terminals, this product offers multiple connection options and versatility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in mounting options and thermal management, ensuring optimal performance and reliability.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures up to 85°C, suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Can operate effectively in extremely low temperatures down to -40°C, making it suitable for a wide range of environments.

Terminal Position: QUAD

The quad terminal position enhances connectivity and ease of installation, contributing to a simplified and efficient circuit design.

Maximum Seated Height: 0.8 mm

The low seated height of 0.8mm allows for a compact and slim profile, ideal for applications with limited space constraints.

Width (mm): 6 mm

A width of 6mm provides a balance between compactness and functionality, making this product suitable for a wide range of electronic devices.

Other IC type: PLL FREQUENCY SYNTHESIZER

Incorporating a PLL frequency synthesizer enhances frequency stability and accuracy, critical for applications requiring precise signal generation.

Minimum Supply Voltage (Vsup): 2.8 V

Can operate at a low minimum supply voltage of 2.8V, offering compatibility with a diverse range of power sources and energy-efficient applications.

Length: 6 mm

The compact length of 6mm contributes to a space-saving design, ideal for applications where size and efficiency are key factors.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliable performance under harsh conditions and stringent operational requirements.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and efficiency in signal processing.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and improves reliability in connection, enhancing the overall durability of the product.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, this product enables high-density circuit designs, optimizing space utilization in electronic systems.

Maximum Supply Voltage (Vsup): 3.2 V

With a maximum supply voltage of 3.2V, this product offers a safety margin for voltage variations, ensuring stable and secure operation.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQE2820E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

LMX2531LQE2820E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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