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LMX2330LTM/NOPB

Texas Instruments

LMX2330LTM/NOPB by Texas Instruments

LMX2330LTM/NOPB by Texas Instruments is a PLL & Frequency Synthesis Circuit with 20 terminals, operating at -40 to 85°C. It has a supply voltage of 3/5V and consumes 6.6mA max current. Ideal for industrial applications requiring a compact (4.4x6.5mm) surface-mount solution with a bandwidth of 4.4kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,845 parts In-Stock

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Astute Electronics Inc

. 2,285 parts In-Stock

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2,285

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Digiode

USA . 869 parts In-Stock

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869

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Anansix

USA . 570 parts In-Stock

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570

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LIBRA Elektronik GmbH

Germany . 155 parts In-Stock

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One Stop Electronics

USA . 1,066 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 1,435 parts In-Stock

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$2.664

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$3.150

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DigiPath Technology Company

USA . 1,925 parts In-Stock

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$2.933

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$2.698

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$2.933

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ChromeModa Solutions

Germany . 3,025 parts In-Stock

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$2.993

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$2.454

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$2.993

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IDEA Electronic Components Group

UK . 945 parts In-Stock

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$2.993

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$2.694

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945

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AZTECH Wire

Italy . 507 parts In-Stock

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$12.177

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507

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QUARKTWIN TECHNOLOGY LTD

USA . 14,293 parts In-Stock

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Corphita

USA . 5,108 parts In-Stock

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Microchip USA

USA . 488 parts In-Stock

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488

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Overview

Unleash the power of precision with the LMX2330LTM/NOPB by Texas Instruments. Crafted with top-notch quality and unrivaled expertise, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit is designed to deliver unmatched performance in a wide range of applications. From telecommunications to radar systems, this product offers exceptional value, reliability, and efficiency. With its compact design and advanced technology, the LMX2330LTM/NOPB is the perfect solution for all your frequency synthesis needs. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3/5

Offers flexibility in power requirements, making it compatible with a range of systems and applications.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without risk of malfunction, ensuring reliable performance.

Technology: BICMOS

Utilizes advanced BiCMOS technology for efficient and precise frequency synthesis, delivering high-performance results.

Nominal Bandwidth: 4.4 kHz

Provides a wide bandwidth range for frequency synthesis, allowing for versatile applications in various electronic devices.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2330LTM/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Nominal Bandwidth:

4.4 kHz

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6.6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2330LTM/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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