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TLC2934PWR

Texas Instruments

TLC2934PWR by Texas Instruments

TLC2934PWR by Texas Instruments is a PLL & Frequency Synthesis Circuit with 14 terminals, operating at 3.3V. It has a small outline package style, suitable for commercial extended temperature applications. The IC features a phase detector and Gull Wing terminal form, making it ideal for compact designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,388 parts In-Stock

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6,388

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Digiode

USA . 1,468 parts In-Stock

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1,468

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Distributors (Availability)

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One Stop Electronics

USA . 1,169 parts In-Stock

1+ parts

$0.500

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1,169

$0.500

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Ampacity Inc.

Singapore . 516 parts In-Stock

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$4.500

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516

$4.500

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Semicontronic

India . 1,330 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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1,330

$6.500

$6.338

$6.305

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Parana Technologies

USA . 1,040 parts In-Stock

1+ parts

$11.767

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$12.170

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1,040

$11.767

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$12.170

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DigiPath Technology Company

USA . 856 parts In-Stock

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$12.957

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856

$12.957

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ChromeModa Solutions

Germany . 6,464 parts In-Stock

1+ parts

$13.221

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$10.841

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6,464

$13.221

$10.841

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IDEA Electronic Components Group

UK . 2,161 parts In-Stock

1+ parts

$13.221

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$12.560

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$11.899

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2,161

$13.221

$12.560

$11.899

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AZTECH Wire

Italy . 580 parts In-Stock

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$14.626

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580

$14.626

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Corphita

USA . 3,366 parts In-Stock

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3,366

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Corohmni

South Africa . 491 parts In-Stock

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491

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Overview

Discover the innovation and reliability of the TLC2934PWR by Texas Instruments, a top-tier manufacturer in the electronics industry. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled performance and precision in a compact package. Ideal for a wide range of applications, this product provides customers with exceptional value, efficiency, and accuracy. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a common supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures stability in various environmental conditions.

Width (mm): 4.4 mm

Compact width allows for space-saving integration in tight layouts.

Minimum Supply Voltage (Vsup): 3.15 V

Low minimum supply voltage enables energy-efficient operation.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TLC2934PWR attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

TLC2934PWR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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