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TRF376117IRHAR

Texas Instruments

TRF376117IRHAR by Texas Instruments

TRF376117IRHAR by Texas Instruments is a PLL & Frequency Synthesis Circuit with 40 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and comes in a square-shaped chip carrier package. Ideal for industrial applications requiring precise frequency control and synchronization.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,963 parts In-Stock

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Digiode

USA . 1,417 parts In-Stock

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1,417

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Distributors (Availability)

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Ampacity Inc.

Singapore . 920 parts In-Stock

1+ parts

$1.500

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920

$1.500

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One Stop Electronics

USA . 918 parts In-Stock

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$2.500

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918

$2.500

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Semicontronic

India . 1,013 parts In-Stock

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$5.500

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$5.362

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$5.335

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1,013

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 411 parts In-Stock

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$8.066

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411

$8.066

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Parana Technologies

USA . 432 parts In-Stock

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$21.185

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$21.473

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432

$21.185

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$21.473

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DigiPath Technology Company

USA . 1,186 parts In-Stock

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$23.327

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$21.461

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1,186

$23.327

$21.461

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ChromeModa Solutions

Germany . 328 parts In-Stock

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$23.803

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$19.518

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328

$23.803

$19.518

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IDEA Electronic Components Group

UK . 270 parts In-Stock

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$23.803

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$22.613

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$21.423

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$23.803

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Corohmni

South Africa . 360 parts In-Stock

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Corphita

USA . 195 parts In-Stock

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Overview

Upgrade your frequency synthesis circuits with the TRF376117IRHAR by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliability and performance in every product. The TRF376117IRHAR offers precise phase-locked loops, ensuring stable and accurate frequency control for a variety of applications. With its industrial-grade temperature range and innovative chip carrier package style, this PLL circuit provides unmatched value and benefits to customers seeking superior frequency synthesis solutions. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration simpler.

No. of Terminals: 40

Having 40 terminals allows for a high level of connectivity and functionality, enabling complex frequency synthesis and PLL operations.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, suitable for industrial environments where temperature can fluctuate.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures down to -40°C, making it suitable for a wide range of environmental conditions.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm allows for high density packaging and close spacing of components, enabling compact and efficient design layouts.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TRF376117IRHAR attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TRF376117IRHAR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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