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LMX2337M

Texas Instruments

LMX2337M by Texas Instruments

LMX2337M by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage of 2.7-5.5V, and BICMOS technology. It has a small outline package shape suitable for industrial applications, with a temperature range of -40 to 85°C. This surface-mount device features dual-position gull-wing terminals and consumes up to 18mA supply current at 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,955 parts In-Stock

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Anansix

USA . 1,919 parts In-Stock

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Digiode

USA . 679 parts In-Stock

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LittleDiode

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One Stop Electronics

USA . 942 parts In-Stock

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$5.500

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942

$5.500

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Parana Technologies

USA . 970 parts In-Stock

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$9.050

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$9.711

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AZTECH Wire

Italy . 638 parts In-Stock

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$9.185

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$9.185

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DigiPath Technology Company

USA . 1,852 parts In-Stock

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$9.965

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$9.965

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ChromeModa Solutions

Germany . 4,996 parts In-Stock

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$10.168

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$8.338

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IDEA Electronic Components Group

UK . 539 parts In-Stock

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$10.168

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$9.660

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$9.151

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539

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$9.151

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Lixinc

USA . 18,909 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 664 parts In-Stock

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Kepictronics

USA . 86 parts In-Stock

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Overview

Elevate your electronic designs with the LMX2337M from Texas Instruments, a leading manufacturer in the industry. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled quality and reliability for a wide range of applications. With a compact design and a wide temperature range, this product provides exceptional value and performance. Experience seamless integration and precise frequency control with the LMX2337M, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V makes it compatible with many other devices and systems, simplifying integration.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures ensures reliability and performance in diverse environmental conditions.

Technology: BICMOS

Using BiCMOS technology combines the benefits of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and reliability during handling and assembly processes.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2337M attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

7-BIT AUXILIARY INPUT COUNTER; SELECTABLE 64/65 OR 128/129 PRESCALER

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

18 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LMX2337M Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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