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LMX2337TM

Texas Instruments

LMX2337TM by Texas Instruments

LMX2337TM by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage of 2.7-5.5V, and BICMOS technology. It has a small outline package suitable for industrial applications, with a temperature range of -40 to 85°C. This device offers precise frequency synthesis in compact designs for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,429 parts In-Stock

1+ parts

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4,429

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Anansix

USA . 2,620 parts In-Stock

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2,620

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Vyrian

USA . 2,558 parts In-Stock

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2,558

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Cogito LLC

Ukraine . 320 parts In-Stock

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320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 837 parts In-Stock

1+ parts

$7.500

100+ parts

-

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837

$7.500

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AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$15.058

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376

$15.058

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Parana Technologies

USA . 2,107 parts In-Stock

1+ parts

$15.540

100+ parts

-

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$15.915

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2,107

$15.540

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$15.915

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DigiPath Technology Company

USA . 2,241 parts In-Stock

1+ parts

$17.112

100+ parts

$15.743

1k+ parts

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2,241

$17.112

$15.743

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ChromeModa Solutions

Germany . 831 parts In-Stock

1+ parts

$17.461

100+ parts

$14.318

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831

$17.461

$14.318

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IDEA Electronic Components Group

UK . 471 parts In-Stock

1+ parts

$17.461

100+ parts

$16.588

1k+ parts

$15.715

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471

$17.461

$16.588

$15.715

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Corphita

USA . 2,142 parts In-Stock

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2,142

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Speed Components Ltd (Excess)

Israel . 188 parts In-Stock

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188

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Overview

Elevate your frequency synthesis circuits with the LMX2337TM by Texas Instruments. Crafted with precision and quality, this Phase Locked Loop (PLL) offers unparalleled performance and reliability. Whether you're in telecommunications, aerospace, or industrial applications, the LMX2337TM is designed to meet your needs. With a compact design and wide operating temperature range, this PLL Frequency Synthesizer provides exceptional value and versatility. Trust Texas Instruments for cutting-edge technology that delivers optimal results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the product, ensuring reliability and longevity.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is commonly available and easily compatible with other electronic components, making integration into existing systems seamless.

Technology: BICMOS

Utilizing BICMOS technology allows for high-speed operation, low power consumption, and improved noise immunity, making this product efficient and reliable for frequency synthesis applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can perform reliably in a wide range of environments, making it suitable for industrial applications.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for higher terminal density, saving space on the PCB and enabling the design of compact and efficient systems.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2337TM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

18 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2337TM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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