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LMX2532LQX0967

Texas Instruments

LMX2532LQX0967 by Texas Instruments

LMX2532LQX0967 by Texas Instruments is a PLL frequency synthesizer with 28 terminals, operating voltage of 2.7-3.3V, and package style of chip carrier. It has a temperature range of -30 to 85°C and peak reflow temp of 260°C. Ideal for applications requiring precise frequency synthesis in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,085 parts In-Stock

1+ parts

-

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5,085

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Vyrian

USA . 4,421 parts In-Stock

1+ parts

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4,421

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Anansix

USA . 1,555 parts In-Stock

1+ parts

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1,555

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 50 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

$3.363

10k+ parts

-

50

$2.871

-

$3.363

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ChromeModa Solutions

Germany . 4,238 parts In-Stock

1+ parts

$3.226

100+ parts

$2.645

1k+ parts

-

10k+ parts

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4,238

$3.226

$2.645

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IDEA Electronic Components Group

UK . 1,698 parts In-Stock

1+ parts

$3.226

100+ parts

-

1k+ parts

$2.903

10k+ parts

-

1,698

$3.226

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$2.903

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Ampacity Inc.

Singapore . 1,167 parts In-Stock

1+ parts

$5.500

100+ parts

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1,167

$5.500

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One Stop Electronics

USA . 742 parts In-Stock

1+ parts

$6.500

100+ parts

-

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742

$6.500

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$6.975

100+ parts

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873

$6.975

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Corphita

USA . 2,464 parts In-Stock

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2,464

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DigiPath Technology Company

USA . 722 parts In-Stock

1+ parts

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100+ parts

$2.909

1k+ parts

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10k+ parts

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722

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$2.909

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Overview

Elevate your electronic designs with the LMX2532LQX0967 by Texas Instruments, a top-of-the-line Phase Locked Loop & Frequency Synthesis Circuit. Crafted with precision by a renowned manufacturer, this surface mount device offers unparalleled performance and reliability. Whether you're designing communication systems or radar applications, this PLL Frequency Synthesizer will provide the accuracy and stability you need. Trust in Texas Instruments for cutting-edge technology that delivers exceptional value and efficiency to meet all your project requirements.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure installation on a PCB, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 2.8 V

Optimal voltage level ensuring reliable operation and performance of the product.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Compact and thin profile package design helps in saving space on the PCB and enables sleek product design.

Maximum Operating Temperature: 85 °C

Wide temperature range allows for reliable performance in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and ensures strong connections for long-term reliability.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2532LQX0967 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

21 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LMX2532LQX0967 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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