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LMX2326TM

Texas Instruments

LMX2326TM by Texas Instruments

LMX2326TM by Texas Instruments is a PLL frequency synthesizer with 16 terminals, operating voltage range of 2.3V to 5.5V, and temperature range of -40°C to 85°C. It features BICMOS technology in a small outline package suitable for industrial applications requiring precise frequency synthesis.

Median Price

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Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Vyrian

USA . 7,592 parts In-Stock

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Chip Stock

USA . 5,400 parts In-Stock

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5,400

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Digiode

USA . 4,418 parts In-Stock

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Anansix

USA . 865 parts In-Stock

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865

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Semi Source

USA . 753 parts In-Stock

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753

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Prism Electronics

USA . 289 parts In-Stock

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289

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Bristol Electronics

USA . 221 parts In-Stock

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221

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Legend Electronics Inc.

USA . 86 parts In-Stock

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86

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Semtec, LLC

USA . 73 parts In-Stock

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Connector Distribution Corp

USA . 59 parts In-Stock

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Right Parts Inc.

USA . 59 parts In-Stock

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DF Sales Co.

USA . 32 parts In-Stock

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DF Sales Co.

USA . 32 parts In-Stock

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Speed Components Ltd

Israel . 25 parts In-Stock

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LWI Electronics Inc

India . 15 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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One Stop Electronics

USA . 1,612 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 133 parts In-Stock

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$14.380

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$14.824

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DigiPath Technology Company

USA . 274 parts In-Stock

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$15.834

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$14.567

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274

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ChromeModa Solutions

Germany . 2,857 parts In-Stock

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$16.157

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$13.249

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IDEA Electronic Components Group

UK . 2,089 parts In-Stock

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$16.157

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$15.349

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$14.541

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AZTECH Wire

Italy . 552 parts In-Stock

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$19.159

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Lixinc

USA . 17,978 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 1,035 parts In-Stock

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Perfect Parts

USA . 342 parts In-Stock

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Kepictronics

USA . 220 parts In-Stock

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Overview

Unlock precision and reliability with the LMX2326TM from Texas Instruments. As a leader in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Texas Instruments guarantees top-notch quality and performance. This versatile product offers seamless frequency synthesis solutions for a wide range of applications. With its compact design and industrial-grade technology, the LMX2326TM ensures optimal results in any environment. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the internal components of the PLL & Frequency Synthesis Circuit, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making installation and assembly efficient.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V offers a balance between power consumption and performance, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this PLL & Frequency Synthesis Circuit can withstand demanding environmental conditions and maintain reliable operation.

Technology: BICMOS

Utilizing BICMOS technology ensures a combination of the advantages of both bipolar and CMOS technologies, offering high speed performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2326TM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2326TM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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