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LMX2531LQE1146E

Texas Instruments

LMX2531LQE1146E by Texas Instruments

LMX2531LQE1146E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating voltage of 2.8-3.2V, and temperature range of -40 to 85°C. It features BICMOS technology, square package shape, and surface mount capability. Ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

$13.762

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 203 parts In-Stock

1+ parts

$13.762

100+ parts

$14.450

1k+ parts

$13.625

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203

$13.762

$14.450

$13.625

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Vyrian

USA . 4,448 parts In-Stock

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Anansix

USA . 2,802 parts In-Stock

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2,802

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Digiode

USA . 1,183 parts In-Stock

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One Stop Electronics

USA . 330 parts In-Stock

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$2.500

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330

$2.500

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Parana Technologies

USA . 1,977 parts In-Stock

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$10.182

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$10.720

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1,977

$10.182

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$10.720

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DigiPath Technology Company

USA . 1,069 parts In-Stock

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$11.211

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1,069

$11.211

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ChromeModa Solutions

Germany . 2,097 parts In-Stock

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$11.440

100+ parts

$9.381

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2,097

$11.440

$9.381

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IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$11.440

100+ parts

$10.868

1k+ parts

$10.296

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387

$11.440

$10.868

$10.296

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AZTECH Wire

Italy . 797 parts In-Stock

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$14.369

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$14.369

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Lixinc

USA . 8,522 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,928 parts In-Stock

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Overview

Unlock the power of precise frequency synthesis with the LMX2531LQE1146E by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. Ideal for applications in phase-locked loops, this surface-mount chip offers a nominal supply voltage of 3V and operates in temperatures ranging from -40 to 85°C. With 36 terminals and a compact square package shape, this PLL frequency synthesizer provides unmatched performance and flexibility. Experience seamless integration and exceptional value with the LMX2531LQE1146E, setting new standards in frequency control technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort in the manufacturing process.

Nominal Supply Voltage (Vsup): 3 V

Operates at a commonly used voltage level, making it compatible with a wide range of applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers efficient heat dissipation and a compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can withstand relatively high temperatures, ensuring reliable performance in various environmental conditions.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies, providing a balance between speed and power efficiency.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQE1146E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e0

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2531LQE1146E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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