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LMX2332LSLDX

Texas Instruments

LMX2332LSLDX by Texas Instruments

LMX2332LSLDX by Texas Instruments is a PLL frequency synthesizer with 20 terminals in a chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It has a max supply current of 4.1mA and operates on power supplies of 3/5V, making it ideal for various frequency synthesis circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,754 parts In-Stock

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3,754

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Digiode

USA . 2,831 parts In-Stock

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2,831

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Anansix

USA . 1,056 parts In-Stock

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1,056

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Distributors (Availability)

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One Stop Electronics

USA . 1,312 parts In-Stock

1+ parts

$2.500

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1,312

$2.500

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Parana Technologies

USA . 480 parts In-Stock

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$4.639

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$5.113

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480

$4.639

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$5.113

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DigiPath Technology Company

USA . 409 parts In-Stock

1+ parts

$5.108

100+ parts

$4.699

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409

$5.108

$4.699

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ChromeModa Solutions

Germany . 5,353 parts In-Stock

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$5.212

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$4.274

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5,353

$5.212

$4.274

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IDEA Electronic Components Group

UK . 446 parts In-Stock

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$5.212

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$4.691

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446

$5.212

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$4.691

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AZTECH Wire

Italy . 260 parts In-Stock

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$9.379

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260

$9.379

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 1,752 parts In-Stock

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1,752

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Overview

Unlock the power of precise frequency synthesis with the LMX2332LSLDX by Texas Instruments. This top-quality PLL frequency synthesizer offers unmatched performance and reliability in industrial-grade applications. With a wide temperature range and low supply current, this chip carrier package is perfect for demanding environments. Experience seamless integration and improved efficiency with the LMX2332LSLDX, setting a new standard in frequency synthesis circuits. Elevate your projects with Texas Instruments' cutting-edge technology and stay ahead in the game.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good thermal and mechanical properties, ensuring durability and long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement during assembly.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) increases flexibility in designing and integrating the product into different systems.

No. of Terminals: 20

The high number of terminals allows for more connections and functionality in the circuit, enabling complex operations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides good thermal performance and easy heat dissipation, crucial for stable operation in industrial settings.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in demanding environments without risking damage to the product.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function effectively even in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and enhances the overall ease of use of the product.

Other IC type: PLL FREQUENCY SYNTHESIZER

Being a PLL frequency synthesizer, the product offers precise frequency control and stability, critical for applications requiring accurate timing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments with varying temperature conditions.

Maximum Supply Current (Isup): 4.1 mA

The low maximum supply current consumption helps in minimizing power usage and improving overall energy efficiency.

Technology: BICMOS

The use of BiCMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and enhances reliability by reducing potential points of failure.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for compact design and precise alignment of terminals, ensuring proper connectivity.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2332LSLDX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.1 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LMX2332LSLDX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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