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LMX2541SQE2690E/NOPB

Texas Instruments

LMX2541SQE2690E/NOPB by Texas Instruments

LMX2541SQE2690E/NOPB by Texas Instruments is a PLL frequency synthesizer with a max output freq of 4000 GHz. Operating at 3.3V, it has 36 terminals in a square chip carrier package suitable for industrial applications. With BICMOS technology and quad terminal position, it offers precise frequency synthesis capabilities up to 85°C.

Median Price

$12.398

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$11.020

1k+ parts

$9.860

10k+ parts

$9.280

750

-

$11.020

$9.860

$9.280

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$13.775

1k+ parts

$12.325

10k+ parts

$11.600

750

-

$13.775

$12.325

$11.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,152 parts In-Stock

1+ parts

$9.700

100+ parts

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2,152

$9.700

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Vyrian

USA . 456 parts In-Stock

1+ parts

$10.210

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456

$10.210

-

-

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Anansix

USA . 1,005 parts In-Stock

1+ parts

-

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1,005

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Inventory MP

USA . 6 parts In-Stock

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6

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,887 parts In-Stock

1+ parts

$9.189

100+ parts

-

1k+ parts

-

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1,887

$9.189

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Component Stockers USA

USA . 6,960 parts In-Stock

1+ parts

$10.360

100+ parts

$9.740

1k+ parts

$7.810

10k+ parts

-

6,960

$10.360

$9.740

$7.810

-

Parana Technologies

USA . 801 parts In-Stock

1+ parts

$17.022

100+ parts

-

1k+ parts

$17.246

10k+ parts

-

801

$17.022

-

$17.246

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DigiPath Technology Company

USA . 2,058 parts In-Stock

1+ parts

$18.743

100+ parts

$17.244

1k+ parts

-

10k+ parts

-

2,058

$18.743

$17.244

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ChromeModa Solutions

Germany . 3,335 parts In-Stock

1+ parts

$19.126

100+ parts

$15.683

1k+ parts

-

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3,335

$19.126

$15.683

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IDEA Electronic Components Group

UK . 203 parts In-Stock

1+ parts

$19.126

100+ parts

$18.170

1k+ parts

$17.213

10k+ parts

-

203

$19.126

$18.170

$17.213

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Lixinc

USA . 7,897 parts In-Stock

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7,897

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Perfect Parts

USA . 673 parts In-Stock

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673

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Overview

Unlock the power of precision with the LMX2541SQE2690E/NOPB by Texas Instruments. Designed for applications in phase-locked loops and frequency synthesis circuits, this high-quality product offers unparalleled performance and reliability. With a maximum output frequency of 4000 GHz and a wide operating temperature range, this chip carrier is perfect for industrial-grade projects. Trust in Texas Instruments to provide innovative solutions that meet your needs. Elevate your projects with the LMX2541SQE2690E/NOPB today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

Stable supply voltage ensures consistent performance and reliability of the product.

Maximum Output Frequency: 4000 GHz

High output frequency capability enables wide range of applications in communication and signal processing systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for usage in various environments without compromising performance.

Technology: BICMOS

BICMOS technology offers a combination of benefits from both bipolar and CMOS technologies, providing high performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2541SQE2690E/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

4000 GHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

204 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2541SQE2690E/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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