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LMX2470SLEX/NOPB

Texas Instruments

LMX2470SLEX/NOPB by Texas Instruments

LMX2470SLEX/NOPB by Texas Instruments is a PLL frequency synthesizer with a max output frequency of 2600 GHz. It operates at a nominal voltage of 2.5 V and has a package style of chip carrier, very thin profile. Ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

$3.238

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 56,015 parts In-Stock

1+ parts

$3.238

100+ parts

$2.640

1k+ parts

$1.760

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-

56,015

$3.238

$2.640

$1.760

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Mouser Electronics

USA . 1,993 parts In-Stock

1+ parts

$4.950

100+ parts

$3.160

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$2.830

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$2.740

1,993

$4.950

$3.160

$2.830

$2.740

Rochester

USA . 15,682 parts In-Stock

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-

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$2.530

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$2.260

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$2.130

15,682

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$2.530

$2.260

$2.130

DigiKey

USA . 11,190 parts In-Stock

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$3.330

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$3.330

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Verical

USA . 10,682 parts In-Stock

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$2.825

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$2.663

10,682

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$2.663

Distributors (In-Stock)

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Digiode

USA . 4,151 parts In-Stock

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$2.318

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Nova Conductors

Japan . 550 parts In-Stock

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$2.359

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550

$2.359

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Vyrian

USA . 18,653 parts In-Stock

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DigiKey Marketplace

USA . 15,682 parts In-Stock

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15,682

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Netsource Technology, Inc.

USA . 2,500 parts In-Stock

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2,500

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Elcom Components

USA . 1,342 parts In-Stock

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Anansix

USA . 1,238 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 815 parts In-Stock

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Bristol Electronics

USA . 635 parts In-Stock

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$1.307

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$1.148

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635

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$1.307

$1.148

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Microfarads

USA . 613 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Ampacity Inc.

Singapore . 18,863 parts In-Stock

1+ parts

$2.070

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$2.070

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Corphita

USA . 2,380 parts In-Stock

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$2.196

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$2.196

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Netroflash

USA . 500 parts In-Stock

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$2.359

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500

$2.359

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Parana Technologies

USA . 2,207 parts In-Stock

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$5.564

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$6.348

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2,207

$5.564

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DigiPath Technology Company

USA . 1,667 parts In-Stock

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$6.127

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$6.127

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

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$6.252

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$5.627

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1,798

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ChromeModa Solutions

Germany . 1,644 parts In-Stock

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$6.252

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$5.127

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Microchip USA

USA . 4,857 parts In-Stock

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$15.672

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Perfect Parts

USA . 22,795 parts In-Stock

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Lixinc

USA . 11,203 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,926 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,340 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,284 parts In-Stock

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Metaverse IC Inc.

Canada . 1,060 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 1,004 parts In-Stock

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Kepictronics

USA . 993 parts In-Stock

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Overview

Unlock seamless communication and high-performance frequency synthesis with the LMX2470SLEX/NOPB by Texas Instruments. As a leading manufacturer in Phase Locked Loops & Frequency Synthesis Circuits, Texas Instruments delivers top-quality products that guarantee reliability and precision. Perfect for industrial applications, this PLL Frequency Synthesizer offers a wide range of benefits including a maximum output frequency of 2600 GHz, low power consumption, and a compact chip carrier package design. Elevate your projects with the value and efficiency that the LMX2470SLEX/NOPB brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort in the manufacturing process.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a low nominal supply voltage of 2.5 V allows for efficient power consumption, reducing energy costs.

Maximum Output Frequency: 2600 GHz

With a high maximum output frequency of 2600 GHz, this product is capable of handling high-frequency applications with precision.

Maximum Operating Temperature: 85 °C

The product can operate efficiently at high temperatures up to 85°C, suitable for industrial applications where heat may be a factor.

Technology: BICMOS

The use of Bipolar-CMOS technology ensures high performance and reliability, making this product a dependable choice for frequency synthesis circuits.

Peak Reflow Temperature °C: 260

This high peak reflow temperature of 260 °C allows for reliable soldering during assembly, ensuring a secure connection.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2470SLEX/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N24

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

2600 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.17X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

2.75 V

Minimum Supply Voltage (Vsup):

2.25 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

LMX2470SLEX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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