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LMX2330UTMX

Texas Instruments

LMX2330UTMX by Texas Instruments

LMX2330UTMX by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating at 3V. It features a small outline package, industrial temperature grade, and BICMOS technology. With a supply voltage range of 2.7V to 5.5V, it is ideal for applications requiring precise frequency synthesis in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,764 parts In-Stock

1+ parts

-

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6,764

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Digiode

USA . 2,846 parts In-Stock

1+ parts

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2,846

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Anansix

USA . 2,312 parts In-Stock

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2,312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 986 parts In-Stock

1+ parts

$2.500

100+ parts

-

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986

$2.500

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Parana Technologies

USA . 1,115 parts In-Stock

1+ parts

$11.760

100+ parts

-

1k+ parts

$12.159

10k+ parts

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1,115

$11.760

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$12.159

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$12.949

100+ parts

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1,715

$12.949

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AZTECH Wire

Italy . 321 parts In-Stock

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$12.962

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321

$12.962

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ChromeModa Solutions

Germany . 1,696 parts In-Stock

1+ parts

$13.213

100+ parts

$10.835

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1,696

$13.213

$10.835

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IDEA Electronic Components Group

UK . 991 parts In-Stock

1+ parts

$13.213

100+ parts

$12.552

1k+ parts

$11.892

10k+ parts

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991

$13.213

$12.552

$11.892

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Corphita

USA . 564 parts In-Stock

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564

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Overview

Unlock the power of precision frequency synthesis with the LMX2330UTMX by Texas Instruments. Designed with cutting-edge BICMOS technology, this PLL frequency synthesizer offers unparalleled performance and reliability. Ideal for a wide range of applications, from telecommunications to radar systems, this compact and versatile device is sure to meet your frequency synthesis needs. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits that the LMX2330UTMX can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard voltage, making it compatible with most power sources and ensuring stable performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies, offering high performance, low power consumption, and fast switching speeds.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying production processes.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2330UTMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

DUAL MODULUS PRESCALER (RF): 32/33 OR 64/65 AND DUAL MODULUS PRESCALER (IF): 8/9 OR 16/17

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2330UTMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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