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MC14046BF

Onsemi

MC14046BF by Onsemi

MC14046BF by Onsemi is a 16-terminal PLL & Frequency Synthesis Circuit with Vsup of 5V, suitable for military applications. It operates b/w -55 to 125 °C, has a terminal pitch of 1.27mm, and supports surface mount technology.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 11,732 parts In-Stock

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Digiode

USA . 1,104 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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AZTECH Wire

Italy . 777 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,977 parts In-Stock

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Microchip USA

USA . 7,630 parts In-Stock

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Kulean Microsystems

USA . 2,609 parts In-Stock

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Corphita

USA . 1,376 parts In-Stock

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Problanco Electronics

Mexico . 1,228 parts In-Stock

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TANS Electronics

Latvia . 1,195 parts In-Stock

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UHIMA Technologies

Türkiye . 713 parts In-Stock

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Corohmni

South Africa . 318 parts In-Stock

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Metaverse IC Inc.

Canada . 235 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 73 parts In-Stock

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Overview

Unlock the power of precision frequency control with the MC14046BF by Onsemi. Crafted with expertise and cutting-edge technology, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled performance and reliability. Designed for a wide range of applications, from telecommunications to consumer electronics, this product ensures seamless synchronization and unmatched accuracy. Elevate your projects with the superior quality and value that Onsemi brings to every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount packaging allows for easy integration into circuit boards, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a common voltage level, making it compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions, providing versatility in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the product.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC14046BF attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

IT CAN ALSO OPERATE AT 10V OR 15V NOMINAL

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC14046BF Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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