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LMX2330LTM

Texas Instruments

LMX2330LTM by Texas Instruments

LMX2330LTM by Texas Instruments is a PLL frequency synthesizer with 20 terminals, BICMOS technology, and 4.4 kHz nominal bandwidth. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package suitable for surface mount applications. With dual terminal position and low supply current (6.6 mA), it's ideal for compact electronic devices requiring precise frequency synthesis.

Median Price

$10.900

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 28 parts In-Stock

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$10.900

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Vyrian

USA . 6,980 parts In-Stock

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Digiode

USA . 3,874 parts In-Stock

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Anansix

USA . 2,461 parts In-Stock

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NAC Semi

USA . 76 parts In-Stock

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Prism Electronics

USA . 28 parts In-Stock

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Lantek

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Cyclops Electronics Ltd

UK . 18 parts In-Stock

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MISTER SPROCKETS

USA . 14 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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One Stop Electronics

USA . 581 parts In-Stock

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$5.500

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$5.500

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AZTECH Wire

Italy . 700 parts In-Stock

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$12.173

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Parana Technologies

USA . 84 parts In-Stock

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$19.447

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$19.458

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$21.414

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ChromeModa Solutions

Germany . 4,131 parts In-Stock

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$21.851

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$17.918

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IDEA Electronic Components Group

UK . 962 parts In-Stock

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$21.851

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$20.758

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$19.666

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962

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 3,020 parts In-Stock

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Corphita

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Perfect Parts

USA . 31 parts In-Stock

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Overview

Experience unmatched precision and reliability with the LMX2330LTM by Texas Instruments, a top-of-the-line Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Crafted with the highest quality materials and cutting-edge technology, this product offers customers unparalleled performance and versatility in a compact package. Whether you're looking to enhance communication systems, improve signal processing, or optimize frequency synthesis, the LMX2330LTM delivers on all fronts. Trust Texas Instruments to provide the industry-leading solutions you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the package, ensuring long-term performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing costs.

Power Supplies (V): 3/5

Support for multiple power supplies (3V and 5V) offers flexibility in different system configurations.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into various electronic systems and designs.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in harsh cold conditions.

Maximum Supply Current (Isup): 6.6 mA

Low supply current consumption helps in reducing power consumption and extending battery life.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, making it ideal for frequency synthesis circuits.

Nominal Bandwidth: 4.4 kHz

Wide nominal bandwidth enables precise frequency synthesis and locking for various applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2330LTM attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

4.4 kHz

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6.6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

LMX2330LTM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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