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5962-9466401MEX

Texas Instruments

5962-9466401MEX by Texas Instruments

5962-9466401MEX by Texas Instruments is a MILITARY-grade Phase Locked Loop (PLL) IC with Vsup range of 5-18V. Featuring MIL-STD-883 screening, it operates b/w -55 to 125 °C and has 16 terminals in an IN-LINE package. Ideal for frequency synthesis circuits in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,878 parts In-Stock

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7,878

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Digiode

USA . 4,195 parts In-Stock

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4,195

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Distributors (Availability)

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Ampacity Inc.

Singapore . 643 parts In-Stock

1+ parts

$4.500

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643

$4.500

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Semicontronic

India . 615 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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615

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 584 parts In-Stock

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$6.500

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584

$6.500

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Parana Technologies

USA . 591 parts In-Stock

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$7.697

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$8.224

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591

$7.697

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$8.224

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DigiPath Technology Company

USA . 426 parts In-Stock

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$8.475

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$7.797

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426

$8.475

$7.797

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ChromeModa Solutions

Germany . 5,194 parts In-Stock

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$8.648

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$7.091

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$8.648

$7.091

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IDEA Electronic Components Group

UK . 568 parts In-Stock

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$8.648

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$8.216

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$7.783

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568

$8.648

$8.216

$7.783

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AZTECH Wire

Italy . 266 parts In-Stock

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$12.811

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$12.811

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Native Components

USA . 928 parts In-Stock

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Supply Digital

USA . 803 parts In-Stock

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Corphita

USA . 495 parts In-Stock

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495

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Northwest PG Solutions

USA . 272 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the 5962-9466401MEX by Texas Instruments. Crafted with precision and expertise, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unmatched quality and reliability. Ideal for military applications, this product guarantees optimal performance in extreme environments. With a nominal supply voltage of 10V and a temperature range from -55°C to 125°C, this component ensures stable operation under any conditions. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection for internal components, ensuring durability and reliability in harsh environments.

Screening Level: MIL-STD-883

Meets stringent military standards for quality, reliability, and performance, making it suitable for critical applications.

Nominal Supply Voltage (Vsup): 10 V

Provides a stable voltage supply for consistent operation and performance.

No. of Terminals: 16

Offers sufficient connectivity options for integrating the product into various electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, allowing for reliable operation in challenging thermal conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making it energy-efficient and fast.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits 5962-9466401MEX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

5962-9466401MEX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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