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5962-9466401MEA

Texas Instruments

5962-9466401MEA by Texas Instruments

The Texas Instruments 5962-9466401MEA is a MILITARY-grade Phase Locked Loop (PLL) IC with 16 terminals. It operates b/w -55 to 125 °C, with Vsup ranging from 3V to 18V. Suitable for frequency synthesis circuits, it features a CMOS technology and MIL-STD-883 screening level.

Median Price

$9.566

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Freelance Electronics

USA . 1 parts In-Stock

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Vyrian

USA . 7,838 parts In-Stock

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Digiode

USA . 4,083 parts In-Stock

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QIE Inc.

USA . 200 parts In-Stock

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North Shore Components

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Beltway Electronics Company

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MISTER SPROCKETS

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Inventory MP

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Bristol Electronics

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Resion

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Sogenti Electronics

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Microfarads

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EPE Components Inc.

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Ampacity Inc.

Singapore . 1,604 parts In-Stock

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One Stop Electronics

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Parana Technologies

USA . 1,501 parts In-Stock

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$9.414

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$874.189

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$8.472

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DigiPath Technology Company

USA . 834 parts In-Stock

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$10.365

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$9.536

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ChromeModa Solutions

Germany . 4,784 parts In-Stock

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IDEA Electronic Components Group

UK . 1,860 parts In-Stock

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$9.519

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AZTECH Wire

Italy . 477 parts In-Stock

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Native Components

USA . 904 parts In-Stock

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Northwest PG Solutions

USA . 1,128 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Glotronic Ltd.

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Microchip USA

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Supply Digital

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Overview

Unlock the potential of your electronic designs with the 5962-9466401MEA by Texas Instruments. Crafted with precision and expertise, this Phase Locked Loops (PLL) & Frequency Synthesis Circuit offers unparalleled performance and reliability. Whether you're working on military-grade applications or high-end consumer electronics, this product delivers the power supplies and temperature grades needed to excel in any environment. Trust Texas Instruments for cutting-edge technology and superior quality that brings value and innovation to your projects. Elevate your designs with the best in the industry.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability, making this product suitable for demanding applications.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high quality and reliability, meeting stringent military standards.

Nominal Supply Voltage (Vsup): 10 V

Operating at a nominal supply voltage of 10V allows for flexibility in power input while maintaining stable performance.

No. of Terminals: 16

Having 16 terminals provides connectivity options and allows for versatile integration into different circuit designs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without compromising performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable for various applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits 5962-9466401MEA attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-CDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

5962-9466401MEA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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