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5962-8960901EA

Texas Instruments

5962-8960901EA by Texas Instruments

The Texas Instruments 5962-8960901EA is a MIL-STD-883 compliant Phase Locked Loop (PLL) IC with 16 terminals. Operating b/w -55 to 125 °C, it has a supply voltage range of 2-6 V and consumes 0.16 mA current. Ideal for military applications requiring precise frequency synthesis in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 8,573 parts In-Stock

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Digiode

USA . 3,026 parts In-Stock

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ABC Electronics Ltd.

UK . 32 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 22 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 6 parts In-Stock

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Resion

USA . 4 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 4 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Native Components

USA . 3 parts In-Stock

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$0.404

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$0.388

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$0.404

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Northwest PG Solutions

USA . 2,360 parts In-Stock

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$0.444

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$0.392

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$0.444

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AZTECH Wire

Italy . 457 parts In-Stock

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$4.939

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One Stop Electronics

USA . 1,372 parts In-Stock

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Andel Nordic

Denmark . 1,002 parts In-Stock

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$8.055

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$7.732

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Parana Technologies

USA . 321 parts In-Stock

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$16.987

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$17.210

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DigiPath Technology Company

USA . 2,260 parts In-Stock

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$18.705

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$17.209

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ChromeModa Solutions

Germany . 3,916 parts In-Stock

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$19.087

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$15.651

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IDEA Electronic Components Group

UK . 937 parts In-Stock

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$19.087

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$18.133

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$17.178

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$21.768

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$21.551

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$20.680

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Glotronic Ltd.

UK . 3,000 parts In-Stock

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Microchip USA

USA . 2,715 parts In-Stock

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Corphita

USA . 1,060 parts In-Stock

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Supply Digital

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Perfect Parts

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Assy Fe

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A-Plus Industry Inc.

USA . 1 parts In-Stock

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Overview

Elevate your electronic designs with the 5962-8960901EA by Texas Instruments, a top-notch Phase Locked Loops (PLL) & Frequency Synthesis Circuit. Crafted with precision and quality, this innovative product offers unparalleled performance and reliability, making it a must-have for military-grade applications. With its MIL-STD-883 screening level and CMOS technology, this component ensures optimal functionality even in extreme conditions. Trust in Texas Instruments for cutting-edge solutions that deliver value, efficiency, and exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, making the product suitable for rugged environments.

Screening Level: MIL-STD-883

Ensures that the product meets stringent military standards for reliability and performance.

Nominal Supply Voltage (Vsup): 3 V

Optimal supply voltage for efficient and stable operation of the PLL and frequency synthesis circuits.

No. of Terminals: 16

Sufficient number of terminals for connecting various components and interfaces, enhancing versatility.

Maximum Operating Temperature: 125 °C

Allows reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing reliability and efficiency.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits 5962-8960901EA attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

21.34 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

5962-8960901EA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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