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LMX2332LSLBX

Texas Instruments

LMX2332LSLBX by Texas Instruments

LMX2332LSLBX by Texas Instruments is a PLL frequency synthesizer with 24 terminals, BICMOS technology, and 3/5V power supplies. It operates in industrial temperature range (-40 to 85°C) and consumes up to 4.1mA supply current. Ideal for applications requiring precise frequency synthesis in compact chip carrier packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,880 parts In-Stock

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Vyrian

USA . 2,879 parts In-Stock

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2,879

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PC Components Company LLC

USA . 2,220 parts In-Stock

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Bristol Electronics

USA . 2,220 parts In-Stock

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Anansix

USA . 1,283 parts In-Stock

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One Stop Electronics

USA . 192 parts In-Stock

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$4.500

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192

$4.500

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AZTECH Wire

Italy . 844 parts In-Stock

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$6.643

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$6.643

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Parana Technologies

USA . 81 parts In-Stock

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$21.980

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$22.513

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81

$21.980

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$22.513

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ChromeModa Solutions

Germany . 6,643 parts In-Stock

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$24.697

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$20.252

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$24.697

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IDEA Electronic Components Group

UK . 857 parts In-Stock

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$24.697

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$23.462

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$22.227

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857

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A-Z Elektronik GmbH

Germany . 5,889 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,926 parts In-Stock

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Kepictronics

USA . 3,483 parts In-Stock

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Assy Fe

Spain . 3,370 parts In-Stock

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Corphita

USA . 3,224 parts In-Stock

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DigiPath Technology Company

USA . 1,572 parts In-Stock

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$22.267

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$22.267

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Overview

Unlock the power of precision with Texas Instruments' LMX2332LSLBX, a top-of-the-line Phase Locked Loop (PLL) & Frequency Synthesis Circuit. Offering unparalleled quality and reliability, this advanced chip carrier is designed for industrial-grade applications where accuracy is paramount. With a wide temperature range and low supply current, this PLL frequency synthesizer delivers exceptional performance in demanding environments. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations, setting new standards in frequency synthesis circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for a space-efficient design, making it easier to integrate into various electronic circuits and systems.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) provides flexibility in terms of compatibility with different systems and applications.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options, enabling the product to interface with a wide range of external components and devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions or high-temperature settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C further enhances the product's reliability and usability across a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position provides stability and secure connectivity, preventing signal loss or interference in data transmission.

Other IC type: PLL FREQUENCY SYNTHESIZER

Being a PLL frequency synthesizer IC type ensures precise frequency control and stability, making it suitable for applications requiring accurate signal generation and synchronization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates the product's reliability and suitability for industrial environments with demanding temperature conditions.

Maximum Supply Current (Isup): 4.1 mA

The low maximum supply current of 4.1 mA helps in reducing power consumption and ensuring efficient performance in energy-sensitive applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed performance, low power consumption, and improved precision.

Terminal Form: NO LEAD

The no lead terminal form simplifies the connectivity process and minimizes the risk of soldering defects, ensuring a reliable electrical connection.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for compact packaging and space-saving design, making the product suitable for applications with limited board space.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2332LSLBX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.17X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.1 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LMX2332LSLBX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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