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LMX2354SLB

Texas Instruments

LMX2354SLB by Texas Instruments

LMX2354SLB by Texas Instruments is a PLL frequency synthesizer with 24 terminals in a square chip carrier package. It operates at supply voltages of 2.7V to 5.5V, making it suitable for industrial applications with temperature range from -40°C to 85°C. With BICMOS technology and low supply current of 8.5mA, it offers precise frequency synthesis capabilities in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,478 parts In-Stock

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7,478

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Digiode

USA . 4,968 parts In-Stock

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4,968

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Anansix

USA . 1,530 parts In-Stock

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1,530

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Distributors (Availability)

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One Stop Electronics

USA . 638 parts In-Stock

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$6.500

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638

$6.500

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Parana Technologies

USA . 1,584 parts In-Stock

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$12.390

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$12.831

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1,584

$12.390

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$12.831

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$13.643

100+ parts

$12.551

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1,964

$13.643

$12.551

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ChromeModa Solutions

Germany . 1,789 parts In-Stock

1+ parts

$13.921

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$11.415

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1,789

$13.921

$11.415

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IDEA Electronic Components Group

UK . 300 parts In-Stock

1+ parts

$13.921

100+ parts

$13.225

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$12.529

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300

$13.921

$13.225

$12.529

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AZTECH Wire

Italy . 439 parts In-Stock

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$15.220

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439

$15.220

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Corphita

USA . 2,077 parts In-Stock

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2,077

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Metaverse IC Inc.

Canada . 558 parts In-Stock

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558

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Overview

Unlock unparalleled performance and precision with the Texas Instruments LMX2354SLB, a top-of-the-line PLL frequency synthesizer designed to meet the demands of industrial applications. With advanced BICMOS technology, this chip carrier package offers a wide supply voltage range, low supply current, and a compact square shape for easy integration. Whether you're in telecommunications, aerospace, or test equipment, experience the quality and reliability that Texas Instruments is known for with the LMX2354SLB, delivering unmatched value and seamless frequency synthesis solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3 V

Operating at a low nominal supply voltage of 3V allows for energy efficiency and can help reduce power consumption.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and allows for high-density mounting, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is suitable for industrial environments where temperatures can vary.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption, making it an efficient choice for frequency synthesis circuits.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2354SLB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

SELECTABLE PRESCALER OF 16/17 OR 20/21 AND 8/9 OR 12/13

Other IC type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.17X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

8.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3.5 mm

Trade Compliance

LMX2354SLB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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