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LMX2335LMX

Texas Instruments

LMX2335LMX by Texas Instruments

LMX2335LMX by Texas Instruments is a PLL frequency synthesizer with 16 terminals and BICMOS technology. It operates at a supply voltage range of 2.7V to 5.5V, making it suitable for industrial applications requiring precise frequency synthesis in temperature ranges from -40°C to 85°C. This small outline package with gull wing terminals is surface mountable and ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,400 parts In-Stock

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5,400

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Digiode

USA . 3,808 parts In-Stock

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3,808

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Anansix

USA . 1,454 parts In-Stock

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1,454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,221 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,221

$4.500

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Parana Technologies

USA . 665 parts In-Stock

1+ parts

$4.518

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$4.964

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665

$4.518

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$4.964

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

$4.974

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1,086

$4.974

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ChromeModa Solutions

Germany . 1,129 parts In-Stock

1+ parts

$5.076

100+ parts

$4.162

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1,129

$5.076

$4.162

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IDEA Electronic Components Group

UK . 214 parts In-Stock

1+ parts

$5.076

100+ parts

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$4.568

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214

$5.076

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$4.568

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AZTECH Wire

Italy . 625 parts In-Stock

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$19.178

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625

$19.178

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Corphita

USA . 1,234 parts In-Stock

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1,234

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Overview

Unlock the power of precision frequency synthesis with the LMX2335LMX by Texas Instruments. Crafted with top-notch quality and expertise, this Phase Locked Loop (PLL) offers unparalleled performance in a compact package. Ideal for industrial applications, this PLL frequency synthesizer boasts a wide operating temperature range and low power consumption, making it a reliable choice for demanding environments. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with precision and efficiency. Elevate your projects with the LMX2335LMX and experience the benefits of superior design and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product affordable for customers.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a common voltage level, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, providing durability under various conditions.

Technology: BICMOS

Utilizes BiCMOS technology for a combination of Bipolar and CMOS benefits, offering high-speed performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2335LMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

5.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LMX2335LMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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