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LMX2487SQX/NOPB

Texas Instruments

LMX2487SQX/NOPB by Texas Instruments

LMX2487SQX/NOPB by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at 3V. It features a max temperature of 85°C and min of -40°C, suitable for industrial applications. The chip carrier package is surface mountable with matte tin finish, making it ideal for various frequency synthesis circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,550 parts In-Stock

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Digiode

USA . 3,362 parts In-Stock

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Anansix

USA . 2,151 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.050

100+ parts

$1.866

1k+ parts

$1.681

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3,000

$2.050

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$1.681

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One Stop Electronics

USA . 719 parts In-Stock

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$3.500

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719

$3.500

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AZTECH Wire

Italy . 794 parts In-Stock

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$11.457

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794

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Parana Technologies

USA . 1,453 parts In-Stock

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$19.489

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$19.495

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1,453

$19.489

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$19.495

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IDEA Electronic Components Group

UK . 1,585 parts In-Stock

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$21.898

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$20.803

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$19.708

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1,585

$21.898

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$19.708

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ChromeModa Solutions

Germany . 177 parts In-Stock

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$21.898

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$17.956

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177

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$17.956

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QUARKTWIN TECHNOLOGY LTD

USA . 9,427 parts In-Stock

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Corphita

USA . 2,502 parts In-Stock

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DigiPath Technology Company

USA . 1,674 parts In-Stock

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$19.743

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1,674

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$19.743

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Microchip USA

USA . 328 parts In-Stock

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328

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Overview

Experience the next level of precision and reliability with Texas Instruments' LMX2487SQX/NOPB PLL Frequency Synthesizer. This cutting-edge technology offers unmatched performance in Phase Locked Loops, making it ideal for a wide range of applications. With a compact square package body and industrial-grade temperature tolerance, this product ensures seamless integration and long-term durability. Trust Texas Instruments to deliver top-notch quality and innovation in every aspect of your design process. Elevate your projects with the LMX2487SQX/NOPB and unlock endless possibilities in frequency synthesis circuits.

Feature Benefit Bullets

Package Body Material

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

Nominal Supply Voltage (Vsup)

The nominal supply voltage of 3V makes this product compatible with a wide range of electronic systems.

Maximum Operating Temperature

With a high maximum operating temperature of 85°C, this product can withstand tough environmental conditions.

Technology

Utilizing CMOS technology ensures low power consumption and high noise immunity, making it an efficient choice.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2487SQX/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LMX2487SQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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