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LMX2531LQX1700E

Texas Instruments

LMX2531LQX1700E by Texas Instruments

LMX2531LQX1700E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage range of 2.8V to 3.2V and comes in a square chip carrier package style. Ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 5,302 parts In-Stock

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Vyrian

USA . 4,385 parts In-Stock

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4,385

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Anansix

USA . 283 parts In-Stock

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283

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Distributors (Availability)

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Parana Technologies

USA . 753 parts In-Stock

1+ parts

$1.815

100+ parts

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$2.369

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753

$1.815

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$2.369

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DigiPath Technology Company

USA . 2,342 parts In-Stock

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$1.998

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$1.838

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2,342

$1.998

$1.838

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ChromeModa Solutions

Germany . 2,889 parts In-Stock

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$2.039

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$1.672

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$2.039

$1.672

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

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$2.039

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$1.835

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1,804

$2.039

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$1.835

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One Stop Electronics

USA . 883 parts In-Stock

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$3.500

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883

$3.500

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AZTECH Wire

Italy . 592 parts In-Stock

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$12.430

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Corphita

USA . 5,197 parts In-Stock

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Overview

Elevate your frequency control with the Texas Instruments LMX2531LQX1700E PLL Frequency Synthesizer. Crafted with precision and reliability in mind, this square-shaped chip carrier offers seamless surface mounting for easy integration into a variety of applications. From industrial to consumer electronics, this versatile device operates flawlessly within a wide temperature range, ensuring optimal performance at all times. Trust in Texas Instruments' unmatched quality and innovation to deliver superior results for your projects. Experience the value and benefits that the LMX2531LQX1700E brings to the table, setting new standards in frequency synthesis circuits.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto PCBs, making installation and assembly convenient.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board and allowing for tight integration with other components.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 36

Having 36 terminals allows for versatile connectivity options and ensures compatibility with a variety of circuit configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier packaging, heat sink/slug design, and very thin profile provides efficient heat dissipation and compact size, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C allows for operation in both extreme cold and hot temperatures, making this product suitable for diverse environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability, ensuring secure connections and long-lasting performance.

Terminal Position: QUAD

The quad terminal position offers easy access to all connections, simplifying installation and maintenance of the product.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this product has a low profile design that saves space and allows for compact integration in electronic systems.

Width (mm): 6 mm

The 6mm width provides a compact form factor, allowing for efficient use of space on the circuit board and facilitating dense layout designs.

Other IC type: PLL FREQUENCY SYNTHESIZER

Being a PLL frequency synthesizer, this product offers precise frequency control and synchronization, making it ideal for applications where stable and accurate frequency generation is required.

Minimum Supply Voltage (Vsup): 2.8 V

Operating at a minimum supply voltage of 2.8V ensures low power consumption and extends battery life in portable electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing processes, contributing to product reliability.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235°C, this product can withstand the soldering process without damage, ensuring robust construction and reliable performance.

Length: 6 mm

The 6mm length contributes to the compact design of the product, allowing for efficient use of space and facilitating versatile mounting options.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets rigorous performance and reliability standards, making it suitable for harsh operating environments.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed, low power consumption, and excellent reliability in a single solution.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination, making this product environmentally friendly and compliant with RoHS regulations.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product allows for fine-pitch connections, enabling high-density integration and precise signal routing on the circuit board.

Maximum Supply Voltage (Vsup): 3.2 V

Operating at a maximum supply voltage of 3.2V provides a safety margin for voltage fluctuations and ensures stable operation in various power supply conditions.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQX1700E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e0

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.2 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2531LQX1700E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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