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CD4046BNSRG4

Texas Instruments

CD4046BNSRG4 by Texas Instruments

CD4046BNSRG4 by Texas Instruments is a Phase Locked Loop (PLL) & Frequency Synthesis Circuit with 1 function. It operates at a nominal voltage of 10V and has a temperature range of -55 to 125°C. This IC is commonly used in applications requiring frequency synthesis and phase-locked loop functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 22,300 parts In-Stock

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Vyrian

USA . 4,769 parts In-Stock

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4,769

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Digiode

USA . 2,432 parts In-Stock

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2,432

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QIE Inc.

USA . 1,800 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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One Stop Electronics

USA . 822 parts In-Stock

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$3.500

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822

$3.500

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Ampacity Inc.

Singapore . 840 parts In-Stock

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$4.500

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840

$4.500

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Parana Technologies

USA . 2,135 parts In-Stock

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$5.393

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$6.085

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2,135

$5.393

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$6.085

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Semicontronic

India . 1,477 parts In-Stock

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$5.500

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$5.362

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$5.335

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Corohmni

South Africa . 281 parts In-Stock

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$5.921

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$5.921

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ChromeModa Solutions

Germany . 6,440 parts In-Stock

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$6.060

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$4.969

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$6.060

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IDEA Electronic Components Group

UK . 738 parts In-Stock

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$6.060

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$5.454

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738

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AZTECH Wire

Italy . 643 parts In-Stock

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$15.359

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$16.640

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$15.808

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500

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Continental Prestige Electronics

USA . 2,977 parts In-Stock

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Argo Parts USA

USA . 2,339 parts In-Stock

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Perfect Parts

USA . 2,241 parts In-Stock

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DigiPath Technology Company

USA . 1,495 parts In-Stock

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$5.464

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Corphita

USA . 1,222 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the CD4046BNSRG4 by Texas Instruments, a high-quality Phase Locked Loop (PLL) & Frequency Synthesis Circuit that delivers unmatched performance. Manufactured by the reputable Texas Instruments, this product guarantees reliability and precision. With its compact SMALL OUTLINE package style, it is suitable for various applications. Whether you're designing communication systems or audio equipment, the CD4046BNSRG4 offers exceptional value with its advanced technology and wide supply voltage range. Unlock endless possibilities with this versatile solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product has a plastic/epoxy package body material, which provides durability and protection to the internal components, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this product offers easy and convenient installation onto circuit boards, saving time and effort during assembly.

No. of Functions: 1

Featuring a single function, this product is designed for specific purposes, ensuring efficient performance and simplifying integration into electronic systems.

Package Shape: RECTANGULAR

The rectangular package shape of this product offers compactness and compatibility with standard board designs, optimizing space utilization in electronic devices.

Nominal Supply Voltage (Vsup): 10 V

With a nominal supply voltage of 10V, this product provides stable and reliable power input, enabling consistent signal processing and frequency synthesis.

Power Supplies (V): 5/15

This product supports a range of power supply options, with voltage inputs of 5V or 15V, making it versatile and adaptable to different circuitry requirements.

No. of Terminals: 16

Equipped with 16 terminals, this product facilitates easy connectivity and integration with other components, allowing seamless operation within electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product ensures space efficiency and compatibility with standardized manufacturing processes, making it well-suited for compact devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated heat levels, enabling reliable performance in demanding environments.

Minimum Operating Temperature: -55 °C

Designed to operate reliably in extremely cold conditions, this product has a minimum operating temperature of -55°C, making it suitable for various outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish of this product provides excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the device.

Terminal Position: DUAL

Featuring dual terminal positions, this product offers flexibility in mounting options, allowing for different orientations and configurations within electronic systems.

Maximum Seated Height: 2 mm

With a low maximum seated height of 2mm, this product minimizes the space required for installation, enabling compact and slim designs.

Width (mm): 5.3 mm

The narrow width of 5.3mm ensures space-saving integration, allowing this product to be installed in tight configurations with other components.

Other IC type: PHASE LOCKED LOOP

This product serves as a phase-locked loop (PLL) and frequency synthesis circuit, providing precise frequency control, stability, and synchronization in various electronic applications.

Minimum Supply Voltage (Vsup): 5 V

With a minimum supply voltage of 5V, this product supports low-power operation, reducing energy consumption and extending battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Designed for efficient soldering processes, this product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable manufacturing and assembly.

Peak Reflow Temperature °C: 260

This product can endure high peak reflow temperatures of up to 260°C during soldering processes, guaranteeing secure and durable solder joints.

Length: 10.2 mm

The compact length of 10.2mm allows for easy integration and placement within electronic circuits, enhancing versatility and enabling design flexibility.

Temperature Grade: MILITARY

This product is classified as a military-grade component, meeting stringent standards for reliability, ruggedness, and performance in challenging operational environments.

Technology: CMOS

Built using complementary metal-oxide-semiconductor (CMOS) technology, this product offers low power consumption, high-speed operation, and excellent noise immunity, making it ideal for various applications.

Terminal Form: GULL WING

The gull wing terminal form of this product provides reliable and secure electrical connectivity, ensuring robust performance and ease of soldering during assembly.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product allows for precise connections and easy integration on standard printed circuit boards, facilitating efficient and accurate placement.

Moisture Sensitivity Level (MSL): 1

This product has a moisture sensitivity level (MSL) rating of 1, indicating its resistance to moisture absorption, ensuring long-term reliability and preventing damage during storage or reflow.

Maximum Supply Voltage (Vsup): 18 V

With a high maximum supply voltage of 18V, this product accommodates diverse power sources, offering versatile application possibilities and ensuring robust operation under varying conditions.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD4046BNSRG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.3 mm

Trade Compliance

CD4046BNSRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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