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LMX2485ESQX

Texas Instruments

LMX2485ESQX by Texas Instruments

LMX2485ESQX by Texas Instruments is a PLL frequency synthesizer with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.5V to 3.6V. Ideal for industrial applications requiring precise frequency synthesis and phase-locked loop functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,914 parts In-Stock

1+ parts

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8,914

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Digiode

USA . 4,381 parts In-Stock

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4,381

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Anansix

USA . 2,374 parts In-Stock

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2,374

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 870 parts In-Stock

1+ parts

$5.437

100+ parts

-

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870

$5.437

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One Stop Electronics

USA . 1,636 parts In-Stock

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$6.500

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1,636

$6.500

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Parana Technologies

USA . 635 parts In-Stock

1+ parts

$9.265

100+ parts

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$9.898

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635

$9.265

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$9.898

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DigiPath Technology Company

USA . 1,543 parts In-Stock

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$10.202

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1,543

$10.202

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ChromeModa Solutions

Germany . 3,629 parts In-Stock

1+ parts

$10.410

100+ parts

$8.536

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3,629

$10.410

$8.536

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

1+ parts

$10.410

100+ parts

$9.890

1k+ parts

$9.369

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1,028

$10.410

$9.890

$9.369

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Perfect Parts

USA . 5,367 parts In-Stock

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5,367

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Corphita

USA . 2,981 parts In-Stock

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2,981

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Overview

Unlock the power of precision frequency synthesis with the LMX2485ESQX by Texas Instruments. Crafted with excellence, this PLL & Frequency Synthesis Circuit offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Experience seamless performance and efficiency with the LMX2485ESQX, where innovation meets excellence. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, the product can be easily integrated into a circuit board, saving space and allowing for high-density layouts.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage means that the product can operate efficiently with a common power source, providing reliability and stability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand a wide range of environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40°C makes it suitable for use in both high-temperature and low-temperature environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish helps in facilitating good solderability and ensuring a reliable electrical connection, enhancing the overall quality of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density packing of components on a PCB, enabling compact and efficient circuit designs.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, the product has moderate sensitivity to moisture, allowing for safe and reliable storage and handling in manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safe operating range for the product, ensuring protection against voltage fluctuations and overloading.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2485ESQX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

QUADRUPLE MODULUS PRESCALER (RF):8/9/12/13 OR 16/17/20/21

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LMX2485ESQX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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