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MC74HC4046ADR2

Onsemi

MC74HC4046ADR2 by Onsemi

MC74HC4046ADR2 by Onsemi is a 16-terminal PLL IC with Vsup ranging from 2V to 6V. It operates in temperatures from -55 °C to 125°C, making it suitable for military-grade applications. The CMOS technology and small outline package make it ideal for frequency synthesis circuits.

Median Price

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Vyrian

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Velocity Electronics

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R&J Components

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Connector Distribution Corp

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Right Parts Inc.

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North Shore Components

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PC Components Company LLC

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SupplyDigital Components

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Kulean Microsystems

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Overview

Unlock a world of precision and reliability with the MC74HC4046ADR2 by Onsemi. This phase-locked loop (PLL) and frequency synthesis circuit offers unparalleled quality and performance, thanks to Onsemi's reputation for excellence in manufacturing. Ideal for a wide range of applications, this product delivers value and benefits beyond compare. Trust in the MC74HC4046ADR2 to provide the advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount capability makes installation and integration of the product easier and more efficient.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5 V ensures stable and consistent performance of the product.

Power Supplies (V): 2/6

The availability of multiple power supply options (2/6 V) offers flexibility in various application scenarios.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and functionalities in the product.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliability and durability in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows for the product to function effectively in extreme cold conditions.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good conductivity and reliability in electrical connections.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC74HC4046ADR2 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

CONTAINS THREE PHASE COMPARATORS

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

MC74HC4046ADR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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