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LMX2377UTMX

Texas Instruments

LMX2377UTMX by Texas Instruments

LMX2377UTMX by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating at a voltage range of 2.7V to 5.5V. It features a small outline package style and operates in industrial temperature grades from -40°C to 85°C. Ideal for applications requiring precise frequency synthesis in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,649 parts In-Stock

1+ parts

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5,649

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Digiode

USA . 2,406 parts In-Stock

1+ parts

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2,406

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Anansix

USA . 1,712 parts In-Stock

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1,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,461 parts In-Stock

1+ parts

$5.500

100+ parts

-

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1,461

$5.500

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Parana Technologies

USA . 72 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

$6.795

10k+ parts

-

72

$6.020

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$6.795

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ChromeModa Solutions

Germany . 4,763 parts In-Stock

1+ parts

$6.764

100+ parts

$5.546

1k+ parts

-

10k+ parts

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4,763

$6.764

$5.546

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IDEA Electronic Components Group

UK . 364 parts In-Stock

1+ parts

$6.764

100+ parts

-

1k+ parts

$6.088

10k+ parts

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364

$6.764

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$6.088

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$10.723

100+ parts

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390

$10.723

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Corphita

USA . 2,558 parts In-Stock

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2,558

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DigiPath Technology Company

USA . 1,993 parts In-Stock

1+ parts

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100+ parts

$6.098

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1,993

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$6.098

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Overview

Unlock the potential of your electronic designs with the LMX2377UTMX by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled performance and reliability. Ideal for a wide range of applications, this product boasts a compact design, low power consumption, and wide operating temperature range. With a nominal supply voltage of 3V and a maximum seated height of just 1.1mm, the LMX2377UTMX provides exceptional value and flexibility to customers looking for high-quality frequency synthesis solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the PLL & Frequency Synthesis Circuits, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 3 V

A moderate supply voltage of 3V allows for efficient power consumption while maintaining optimal performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stable performance.

Technology: BICMOS

The BICMOS technology used in this product combines the advantages of both bipolar and CMOS technologies, resulting in improved speed, power efficiency, and noise immunity.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact design and space-saving, making it suitable for applications where size constraints are a concern.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2377UTMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

SELECTABLE 32/33, 16/17 OR 8/9 PRESCALER

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

4.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LMX2377UTMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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