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MC74HC4046AFL2

Onsemi

MC74HC4046AFL2 by Onsemi

MC74HC4046AFL2 by Onsemi is a CMOS Phase Locked Loop with 16 terminals, operating b/w -55 to 125 °C. It has a power supply range of 2-6V and is MILITARY grade. Ideal for frequency synthesis circuits, it comes in a small outline package with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,069 parts In-Stock

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Digiode

USA . 1,491 parts In-Stock

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Problanco Electronics

Mexico . 7,792 parts In-Stock

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Kulean Microsystems

USA . 5,483 parts In-Stock

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SupplyDigital Components

Austria . 4,439 parts In-Stock

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TANS Electronics

Latvia . 1,514 parts In-Stock

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Corphita

USA . 1,347 parts In-Stock

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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Corohmni

South Africa . 145 parts In-Stock

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Overview

Unlock the power of precision frequency synthesis with the MC74HC4046AFL2 by Onsemi. Designed with top-quality materials and cutting-edge technology, this Phase Locked Loop (PLL) offers unmatched performance and reliability. Perfect for military-grade applications, this small outline package delivers stable and accurate frequency control in extreme temperatures. With Onsemi's reputation for excellence, you can trust that the MC74HC4046AFL2 will exceed your expectations. Experience the difference in precision and quality with this advanced solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and improving overall product quality.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor, making it compatible with a wide range of applications and mounting options.

Power Supplies (V): 2/6

Support for multiple power supply voltages enables flexibility in design and compatibility with various systems.

No. of Terminals: 16

Having a higher number of terminals allows for more connections and functionalities, increasing the product's versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact designs and applications with limited real estate.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the product to operate in extreme cold conditions without compromising functionality.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, simplifying the assembly process and ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for easier PCB layout and routing, reducing the risk of signal interference and improving overall performance.

Temperature Grade: MILITARY

Military-grade temperature rating ensures optimal performance in harsh environments and critical applications where reliability is paramount.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient and versatile choice.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy inspection during assembly, enhancing reliability and ease of maintenance.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting, enabling compact and efficient PCB layouts with multiple components in a limited space.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC74HC4046AFL2 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MC74HC4046AFL2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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