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LMX2312USLDX

Texas Instruments

LMX2312USLDX by Texas Instruments

LMX2312USLDX by Texas Instruments is a PLL frequency synthesizer with 20 terminals, operating voltage range of 2.7V to 5.5V, and temperature grade of industrial. It features a square surface mount package style with dimensions of 3.5mm x 3.5mm, suitable for applications requiring precise frequency synthesis in harsh environments at temperatures ranging from -40°C to 85°C.

Median Price

$11.065

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1,625 parts In-Stock

1+ parts

$11.065

100+ parts

$11.618

1k+ parts

$10.954

10k+ parts

-

1,625

$11.065

$11.618

$10.954

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Vyrian

USA . 7,891 parts In-Stock

1+ parts

-

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-

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-

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7,891

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-

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Bristol Electronics

USA . 6,570 parts In-Stock

1+ parts

-

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-

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6,570

-

-

-

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Anansix

USA . 2,129 parts In-Stock

1+ parts

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2,129

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Digiode

USA . 1,507 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,167 parts In-Stock

1+ parts

$0.951

100+ parts

-

1k+ parts

$1.855

10k+ parts

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1,167

$0.951

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$1.855

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DigiPath Technology Company

USA . 2,072 parts In-Stock

1+ parts

$1.048

100+ parts

-

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2,072

$1.048

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ChromeModa Solutions

Germany . 4,415 parts In-Stock

1+ parts

$1.069

100+ parts

$0.877

1k+ parts

-

10k+ parts

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4,415

$1.069

$0.877

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IDEA Electronic Components Group

UK . 534 parts In-Stock

1+ parts

$1.069

100+ parts

-

1k+ parts

$0.962

10k+ parts

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534

$1.069

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$0.962

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One Stop Electronics

USA . 213 parts In-Stock

1+ parts

$7.500

100+ parts

-

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213

$7.500

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$18.785

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874

$18.785

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Corphita

USA . 808 parts In-Stock

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808

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Overview

Unlock limitless possibilities with the LMX2312USLDX by Texas Instruments. Crafted with precision and expertise, this PLL frequency synthesizer is designed to deliver unparalleled performance in diverse applications. From communications to industrial automation, this versatile chip carrier offers seamless integration, reliability, and superior functionality. Elevate your projects with a trusted name in the industry and experience the value, benefits, and advantages that come with the LMX2312USLDX. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it ideal for applications where board space is limited.

Nominal Supply Voltage (Vsup): 3 V

Operating at a lower nominal supply voltage of 3V helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, enhancing the functionality and versatility of the product.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier with a very thin profile provides a compact and slim design, making it suitable for applications with limited space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in extreme cold conditions without compromising performance.

Terminal Position: QUAD

The quad terminal position provides easy accessibility and connectivity, simplifying the installation and integration process.

Maximum Seated Height: 0.8 mm

The maximum seated height of only 0.8mm contributes to a low-profile design, making it suitable for compact and thin devices.

Width (mm): 3.5 mm

The width of 3.5mm is narrow, allowing for a space-efficient placement on the circuit board and facilitating dense PCB layouts.

Other IC type: PLL FREQUENCY SYNTHESIZER

Being a PLL frequency synthesizer, this product offers precise frequency control and stability, making it ideal for applications requiring accurate signal generation.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V enables operation in low-power scenarios while maintaining functionality and performance.

Length: 3.5 mm

The compact length of 3.5mm complements the square package shape, resulting in a space-efficient and aesthetically pleasing design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and robustness, making it suitable for harsh operating conditions found in industrial environments.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed, low power consumption, and excellent noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joints or lead-related issues, improving reliability and durability.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting, enabling more components to be placed on a PCB and enhancing overall system performance.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in voltage requirements, accommodating a wide range of power supply options for different applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2312USLDX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N20

Length:

3.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3.5 mm

Trade Compliance

LMX2312USLDX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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