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LC72121V-D-TLM-E

Onsemi

LC72121V-D-TLM-E by Onsemi

LC72121V-D-TLM-E by Onsemi is a PLL & Frequency Synthesis Circuit with 24 terminals, operating at -40 to 85 °C. It has a supply voltage of 3/3.3V and consumes up to 6mA. This CMOS technology device is ideal for industrial applications requiring precise frequency control in compact designs.

Median Price

$1.141

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,000 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$0.913

10k+ parts

$0.814

26,000

-

$1.100

$0.913

$0.814

DigiKey

USA . 26,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.380

10k+ parts

-

26,000

-

-

$1.380

-

Verical

USA . 26,000 parts In-Stock

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-

100+ parts

-

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$1.141

10k+ parts

$1.018

26,000

-

-

$1.141

$1.018

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,229 parts In-Stock

1+ parts

$0.854

100+ parts

-

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2,229

$0.854

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-

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Vyrian

USA . 231 parts In-Stock

1+ parts

$0.899

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231

$0.899

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 236 parts In-Stock

1+ parts

$0.809

100+ parts

-

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236

$0.809

-

-

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Corohmni

South Africa . 212 parts In-Stock

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$0.899

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212

$0.899

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-

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Continental Prestige Electronics

USA . 26,000 parts In-Stock

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100+ parts

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$0.745

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26,000

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-

$0.745

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Kulean Microsystems

USA . 6,565 parts In-Stock

1+ parts

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6,565

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TANS Electronics

Latvia . 6,366 parts In-Stock

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6,366

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Problanco Electronics

Mexico . 6,017 parts In-Stock

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6,017

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SupplyDigital Components

Austria . 5,797 parts In-Stock

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5,797

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 2,953 parts In-Stock

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2,953

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Kepictronics

USA . 932 parts In-Stock

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932

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UHIMA Technologies

Türkiye . 58 parts In-Stock

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58

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Overview

Unlock the power of precise frequency synthesis with the LC72121V-D-TLM-E by Onsemi. This cutting-edge Phase Locked Loop (PLL) circuit offers unparalleled quality and reliability, backed by Onsemi's stellar reputation in the industry. Ideal for a wide range of applications, this product provides customers with unmatched value and performance. Say goodbye to compromises and experience the benefits of top-notch technology with the LC72121V-D-TLM-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for use in various electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient placement on circuit boards, saving space and simplifying manufacturing processes.

Power Supplies (V): 3/3.3

Operating at 3/3.3 volts makes this product energy efficient and suitable for low power consumption applications.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, making it versatile for different circuit configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions without compromising performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LC72121V-D-TLM-E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC72121V-D-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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