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LC72121V

Onsemi

LC72121V by Onsemi

LC72121V by Onsemi is a Phase Locked Loop (PLL) & Frequency Synthesis Circuit with 24 terminals in a small outline package. It operates b/w -40 to 85 °C, consuming up to 6mA at 3/3.3V. Ideal for industrial applications requiring precise frequency control and synchronization.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,753 parts In-Stock

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Digiode

USA . 440 parts In-Stock

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SupplyDigital Components

Austria . 8,147 parts In-Stock

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TANS Electronics

Latvia . 3,134 parts In-Stock

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Problanco Electronics

Mexico . 1,873 parts In-Stock

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Corphita

USA . 1,079 parts In-Stock

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Kulean Microsystems

USA . 728 parts In-Stock

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UHIMA Technologies

Türkiye . 128 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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Overview

Enhance your electronic designs with the LC72121V by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As part of the Phase Locked Loops (PLL) & Frequency Synthesis Circuits category, this product offers precise frequency control and stability for your applications. With its small outline package and industrial temperature grade, the LC72121V is perfect for a wide range of projects. Experience the value and benefits of this advanced technology, providing customers with unmatched performance and efficiency. Elevate your designs with the LC72121V today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and protection for the internal components of the PLL and frequency synthesis circuit, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the PLL and frequency synthesis circuit onto PCBs, saving space and reducing assembly time.

Power Supplies (V): 3/3.3

Compatible with common power supply voltages, providing flexibility in integration and power management for various applications.

No. of Terminals: 24

A high number of terminals allow for multiple connections and versatile functionality, catering to complex circuit designs and connectivity requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in challenging environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the PLL and frequency synthesis circuit to operate in extreme cold environments without compromising performance or reliability.

Maximum Supply Current (Isup): 6 mA

Low maximum supply current consumption contributes to energy efficiency and minimizes power usage, which is beneficial for battery-powered devices or applications with power constraints.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall performance and functionality of the PLL and frequency synthesis circuit.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections and ease of soldering during the assembly process, ensuring reliable electrical contact and durability of the circuit.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for dense packing of terminals on the PCB, enabling compact and space-efficient designs while facilitating high-speed and high-frequency signal transmission.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LC72121V attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LC72121V Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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