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LMX2505LQ1321

Texas Instruments

LMX2505LQ1321 by Texas Instruments

LMX2505LQ1321 by Texas Instruments is a PLL frequency synthesizer with 28 terminals, operating voltage of 2.5-3.3V, and temp range -30 to 85°C. Ideal for applications requiring precise frequency synthesis in compact designs due to its square shape, thin profile, and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,873 parts In-Stock

1+ parts

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6,873

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Anansix

USA . 2,185 parts In-Stock

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2,185

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Digiode

USA . 633 parts In-Stock

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633

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Distributors (Availability)

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One Stop Electronics

USA . 689 parts In-Stock

1+ parts

$3.500

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689

$3.500

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Parana Technologies

USA . 71 parts In-Stock

1+ parts

$7.148

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$7.659

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71

$7.148

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$7.659

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DigiPath Technology Company

USA . 2,126 parts In-Stock

1+ parts

$7.870

100+ parts

$7.241

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2,126

$7.870

$7.241

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ChromeModa Solutions

Germany . 4,003 parts In-Stock

1+ parts

$8.031

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$6.585

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4,003

$8.031

$6.585

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IDEA Electronic Components Group

UK . 2,271 parts In-Stock

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$8.031

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$7.228

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2,271

$8.031

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$7.228

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AZTECH Wire

Italy . 844 parts In-Stock

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$8.199

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844

$8.199

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,775 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the LMX2505LQ1321 by Texas Instruments. As a leader in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this surface mount chip carrier offers exceptional value with its low supply voltage, high operating temperatures, and no-lead terminal form. Trust Texas Instruments to provide innovative solutions that exceed your expectations. Elevate your projects with the LMX2505LQ1321 today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a PCB, making this product a convenient choice for assembly.

Nominal Supply Voltage (Vsup): 2.8 V

Operating at a nominal supply voltage of 2.8V makes this product suitable for applications requiring low power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments and perform reliably in challenging conditions.

Moisture Sensitivity Level (MSL): 2

Having a MSL of 2 indicates that this product has a moderate level of moisture sensitivity, making it suitable for a wide range of storage and usage environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2505LQ1321 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LMX2505LQ1321 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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