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LC72130

Onsemi

LC72130 by Onsemi

LC72130 by Onsemi is a Phase Locked Loop (PLL) & Frequency Synthesis Circuit with 24 terminals, operating at temperatures from -40 to 85 °C. It has a supply voltage of 5V and max current of 10mA. This CMOS technology device in rectangular plastic package is ideal for industrial applications requiring precise frequency control.

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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TEDSS.com

USA . 6,204 parts In-Stock

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Resion

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Digiode

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Vyrian

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Cyclops Electronics Ltd

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Sinequanon

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Prism Electronics

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Corohmni

South Africa . 98 parts In-Stock

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TANS Electronics

Latvia . 6,596 parts In-Stock

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Corphita

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Problanco Electronics

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Kulean Microsystems

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Overview

Experience unparalleled quality and precision with the LC72130 by Onsemi. As a leading manufacturer in Phase-Locked Loops & Frequency Synthesis Circuits, Onsemi delivers top-of-the-line products that guarantee optimal performance and reliability. The LC72130's versatile applications make it a must-have for various industries, providing customers with exceptional value and benefits. Trust Onsemi to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the LC72130 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Nominal Supply Voltage (Vsup): 5 V

Having a fixed supply voltage of 5V makes the product easy to integrate into existing systems that operate on the same voltage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for frequency synthesis applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LC72130 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

10 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LC72130 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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