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LMX2531LQX1415E/NOPB

Texas Instruments

LMX2531LQX1415E/NOPB by Texas Instruments

LMX2531LQX1415E/NOPB by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating at 3V. It features a BICMOS technology, matte tin finish, and can withstand industrial temperatures from -40 to 85°C. This chip carrier package is ideal for applications requiring precise frequency synthesis in surface-mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,361 parts In-Stock

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Vyrian

USA . 3,405 parts In-Stock

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Anansix

USA . 302 parts In-Stock

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AZTECH Wire

Italy . 446 parts In-Stock

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$5.304

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One Stop Electronics

USA . 213 parts In-Stock

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$5.500

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Parana Technologies

USA . 798 parts In-Stock

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$11.791

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$12.192

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IDEA Electronic Components Group

UK . 2,050 parts In-Stock

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$13.248

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$12.586

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$11.923

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ChromeModa Solutions

Germany . 449 parts In-Stock

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$13.248

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$10.863

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QUARKTWIN TECHNOLOGY LTD

USA . 13,765 parts In-Stock

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Corphita

USA . 3,987 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 1,412 parts In-Stock

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Overview

Experience high-quality performance with the LMX2531LQX1415E/NOPB by Texas Instruments, a top-tier manufacturer of Phase Locked Loops (PLL) & Frequency Synthesis Circuits. This versatile product offers reliability and precision in a compact SQUARE package, making it ideal for a wide range of applications. With a nominal supply voltage of 3V and advanced BICMOS technology, this PLL FREQUENCY SYNTHESIZER ensures optimal functionality even in extreme industrial temperatures. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Unlock the potential of your projects with the LMX2531LQX1415E/NOPB today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures good durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3 V

Operates efficiently at a low supply voltage of 3V, making it suitable for portable and low-power applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, suitable for industrial and high-performance applications.

Technology: BICMOS

Utilizing BiCMOS technology provides a good balance between speed and power consumption, making this product efficient and high-performing.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQX1415E/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

46 mA

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LMX2531LQX1415E/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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