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LMX2485ESQ

Texas Instruments

LMX2485ESQ by Texas Instruments

LMX2485ESQ by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.5V to 3.6V and comes in a square chip carrier package suitable for industrial applications requiring precise frequency synthesis and phase-locked loops.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,776 parts In-Stock

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5,776

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Anansix

USA . 1,357 parts In-Stock

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1,357

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Digiode

USA . 471 parts In-Stock

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471

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One Stop Electronics

USA . 385 parts In-Stock

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$5.500

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385

$5.500

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AZTECH Wire

Italy . 732 parts In-Stock

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$10.227

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732

$10.227

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Parana Technologies

USA . 1,976 parts In-Stock

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$15.050

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$15.465

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1,976

$15.050

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$15.465

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DigiPath Technology Company

USA . 504 parts In-Stock

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$16.572

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504

$16.572

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IDEA Electronic Components Group

UK . 755 parts In-Stock

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$16.910

100+ parts

$16.064

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$15.219

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755

$16.910

$16.064

$15.219

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ChromeModa Solutions

Germany . 159 parts In-Stock

1+ parts

$16.910

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$13.866

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159

$16.910

$13.866

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Lixinc

USA . 15,870 parts In-Stock

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15,870

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Kepictronics

USA . 800 parts In-Stock

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800

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Corphita

USA . 521 parts In-Stock

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521

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Perfect Parts

USA . 45 parts In-Stock

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45

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Overview

Elevate your electronic designs with the cutting-edge LMX2485ESQ by Texas Instruments. Crafted with precision and expertise, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unrivaled performance and reliability. With a wide range of applications in communications, industrial automation, and beyond, this product delivers exceptional value and benefits to customers. Say goodbye to compromises and hello to seamless integration with the LMX2485ESQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good thermal and electrical insulation, ensuring stable performance in various operating conditions.

Surface Mount: YES

Surface mount packaging provides easy and efficient installation on circuit boards, saving space and improving overall system reliability.

Nominal Supply Voltage (Vsup): 3 V

Operating at 3V, this PLL frequency synthesizer can be easily integrated into various electronic systems with compatible voltage requirements.

No. of Terminals: 24

With 24 terminals, this PLL chip carrier offers versatile connectivity options for interfacing with other components or circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in challenging environmental conditions or high-temperature applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this PLL frequency synthesizer to function effectively in cold environments or under extreme temperature variations.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2485ESQ attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

QUADRUPLE MODULUS PRESCALER (RF):8/9/12/13 OR 16/17/20/21

Other IC type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LMX2485ESQ Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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