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LMX2541SQE2380E

Texas Instruments

LMX2541SQE2380E by Texas Instruments

LMX2541SQE2380E by Texas Instruments is a PLL frequency synthesizer with 36 terminals, operating at 3.3V. It features a square package shape, industrial temperature grade, and BICMOS technology. Ideal for applications requiring precise frequency synthesis in compact designs with surface mount capabilities.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,282 parts In-Stock

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Anansix

USA . 1,980 parts In-Stock

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Digiode

USA . 1,124 parts In-Stock

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ComSIT Distribution GmbH

Germany . 147 parts In-Stock

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One Stop Electronics

USA . 460 parts In-Stock

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$3.500

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460

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AZTECH Wire

Italy . 394 parts In-Stock

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$11.238

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Parana Technologies

USA . 2,103 parts In-Stock

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$13.451

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$13.969

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DigiPath Technology Company

USA . 1,788 parts In-Stock

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$14.811

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$13.626

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ChromeModa Solutions

Germany . 5,193 parts In-Stock

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$15.113

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$12.393

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IDEA Electronic Components Group

UK . 67 parts In-Stock

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$15.113

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$14.357

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$13.602

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67

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Corphita

USA . 3,949 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the LMX2541SQE2380E by Texas Instruments. This top-of-the-line Phase Locked Loop offers unmatched precision and reliability, thanks to the superior quality and expertise of its manufacturer. Perfect for a wide range of applications, this PLL Frequency Synthesizer provides stable performance in industrial settings with a wide operating temperature range. Experience the value of seamless frequency synthesis with the LMX2541SQE2380E, ensuring optimal functionality and efficiency for your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving time and effort in production processes.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, optimizing layout design.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly available supply voltage, ensuring compatibility with various systems.

No. of Terminals: 36

Sufficient number of terminals for connections and interfaces with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style with heat sink and thin profile design for improved thermal performance and space-saving benefits in compact devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions, making it suitable for various applications.

Terminal Position: QUAD

Quad terminal position facilitates easy connectivity and compact board design, ideal for space-constrained applications.

Maximum Seated Height: 0.8 mm

Low seated height contributes to a slim and sleek profile, useful for compact form factor devices.

Width (mm): 6 mm

Narrow width dimension saves space on the PCB and allows for efficient arrangement of components.

Other IC type: PLL FREQUENCY SYNTHESIZER

Integration of PLL frequency synthesizer functionality enhances frequency stability and accuracy for advanced applications.

Minimum Supply Voltage (Vsup): 3.15 V

Low minimum supply voltage ensures energy efficiency and compatibility with low-power systems.

Length: 6 mm

Compact length dimension contributes to overall space-saving design and facilitates versatile placement options on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for rugged applications.

Technology: BICMOS

Utilizes BiCMOS technology for high-performance and power efficiency, offering a balance between bipolar and CMOS characteristics.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly processes and improves reliability in soldering connections.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling compact and space-efficient board layouts.

Maximum Supply Voltage (Vsup): 3.45 V

Safe maximum supply voltage rating ensures protection against voltage spikes and overvoltage conditions, enhancing device durability.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2541SQE2380E attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

LMX2541SQE2380E Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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