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LMX2505LQX1321

Texas Instruments

LMX2505LQX1321 by Texas Instruments

LMX2505LQX1321 by Texas Instruments is a PLL frequency synthesizer with 28 terminals, operating voltage of 2.5-3.3V, and temperature range of -30 to 85°C. It is surface mountable in a square chip carrier package, suitable for applications requiring precise frequency synthesis and phase-locked loops.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,363 parts In-Stock

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7,363

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Digiode

USA . 2,629 parts In-Stock

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2,629

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Anansix

USA . 338 parts In-Stock

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338

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Distributors (Availability)

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One Stop Electronics

USA . 1,138 parts In-Stock

1+ parts

$0.500

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1,138

$0.500

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Parana Technologies

USA . 2,213 parts In-Stock

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$1.711

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$2.302

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2,213

$1.711

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$2.302

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DigiPath Technology Company

USA . 1,762 parts In-Stock

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$1.884

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1,762

$1.884

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ChromeModa Solutions

Germany . 6,674 parts In-Stock

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$1.922

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$1.576

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6,674

$1.922

$1.576

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IDEA Electronic Components Group

UK . 24 parts In-Stock

1+ parts

$1.922

100+ parts

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$1.730

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24

$1.922

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$1.730

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Ampacity Inc.

Singapore . 343 parts In-Stock

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$5.500

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343

$5.500

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AZTECH Wire

Italy . 222 parts In-Stock

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$9.399

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222

$9.399

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,620 parts In-Stock

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Kepictronics

USA . 1,138 parts In-Stock

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Assy Fe

Spain . 1,138 parts In-Stock

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Overview

Get ready to experience unparalleled performance and reliability with the LMX2505LQX1321 by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments brings you the best in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, setting new standards for quality and innovation. This surface mount chip carrier offers a compact design with a very thin profile, making it ideal for a wide range of applications. With a nominal supply voltage of 2.8V and a temperature range from -30°C to 85°C, this PLL frequency synthesizer provides exceptional value and efficiency. Elevate your projects to new heights with the LMX2505LQX1321 - where excellence meets affordability.

Feature Benefit Bullets

Surface Mount: YES

Ease of mounting on PCBs, saves space and allows for automated assembly processes.

Nominal Supply Voltage (Vsup): 2.8 V

Optimal voltage for efficient performance and power consumption.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Compact and low profile design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments without risk of damage.

Terminal Finish: TIN LEAD

Provides good solderability and robust electrical connections.

Width (mm): 5 mm

Narrow width allows for efficient use of space on PCBs.

Other IC type: PLL FREQUENCY SYNTHESIZER

Combines Phase Locked Loop and Frequency Synthesizer functions for precise frequency control.

Minimum Supply Voltage (Vsup): 2.5 V

Can operate at lower voltages for energy efficiency and extended battery life.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during reflow soldering processes.

Moisture Sensitivity Level (MSL): 2

Moderate level of moisture sensitivity, suitable for standard PCB assembly environments.

Maximum Supply Voltage (Vsup): 3.3 V

Can handle higher supply voltages for flexibility in power options.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2505LQX1321 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LMX2505LQX1321 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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