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LB1937T-MPB-E

Onsemi

LB1937T-MPB-E by Onsemi

LB1937T-MPB-E by Onsemi is a Motion Control IC with 24 terminals, operating at -30 to 85 °C. It features a supply voltage range of 2.5V to 9.5V and a max current of 16mA. Ideal for stepper motor control applications due to its compact size and bipolar technology.

Median Price

$2.315

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 575 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

$1.790

10k+ parts

$1.680

575

-

$2.000

$1.790

$1.680

DigiKey

USA . 575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.630

10k+ parts

-

575

-

-

$2.630

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,225 parts In-Stock

1+ parts

$2.109

100+ parts

-

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1,225

$2.109

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Vyrian

USA . 5,831 parts In-Stock

1+ parts

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5,831

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DigiKey Marketplace

USA . 575 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

-

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575

-

$2.310

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 652 parts In-Stock

1+ parts

$1.998

100+ parts

-

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652

$1.998

-

-

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Corohmni

South Africa . 224 parts In-Stock

1+ parts

$2.220

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224

$2.220

-

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Problanco Electronics

Mexico . 7,803 parts In-Stock

1+ parts

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7,803

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Kulean Microsystems

USA . 6,356 parts In-Stock

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6,356

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SupplyDigital Components

Austria . 4,383 parts In-Stock

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4,383

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TANS Electronics

Latvia . 2,164 parts In-Stock

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2,164

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UHIMA Technologies

Türkiye . 202 parts In-Stock

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202

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Microchip USA

USA . 101 parts In-Stock

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101

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Overview

Elevate your motion control applications with the LB1937T-MPB-E by Onsemi. Crafted with precision and expertise, this small outline, thin profile IC offers unparalleled performance and reliability. Perfect for stepper motor control, this product boasts a wide supply voltage range, low power consumption, and dual terminal position for seamless integration. Experience smoother operations, enhanced efficiency, and superior functionality with this innovative motion control solution. Upgrade your projects today with the Onsemi LB1937T-MPB-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for motion control applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of systems and power sources, making it versatile and easy to incorporate into different setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding environments with elevated temperatures.

Technology: BIPOLAR

The bipolar technology used in this product offers high precision and accuracy in controlling motion, making it suitable for applications where precise movement control is critical.

Technical Specifications

Motion Control ICs LB1937T-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

16 mA

Maximum Supply Voltage (Vsup):

9.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB1937T-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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