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LB1847-E

Onsemi

LB1847-E by Onsemi

LB1847-E by Onsemi is a Motion Control IC with 28 terminals in an IN-LINE, SHRINK PITCH package. Operating b/w -20 °C to 85°C, it has a supply voltage range of 5-45V and max current of 36.5mA. Ideal for applications requiring bipolar technology such as robotics and automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,336 parts In-Stock

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Digiode

USA . 1,600 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$10.208

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$9.289

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$8.371

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100

$10.208

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$8.371

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AZTECH Wire

Italy . 1,085 parts In-Stock

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$16.300

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Problanco Electronics

Mexico . 6,436 parts In-Stock

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SupplyDigital Components

Austria . 5,609 parts In-Stock

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5,609

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TANS Electronics

Latvia . 4,759 parts In-Stock

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4,759

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Kulean Microsystems

USA . 2,587 parts In-Stock

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UHIMA Technologies

Türkiye . 776 parts In-Stock

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776

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Perfect Parts

USA . 391 parts In-Stock

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Corohmni

South Africa . 321 parts In-Stock

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Kepictronics

USA . 287 parts In-Stock

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Corphita

USA . 187 parts In-Stock

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Microchip USA

USA . 141 parts In-Stock

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Overview

Experience the ultimate in motion control with the LB1847-E by Onsemi. Crafted with precision and excellence, this product offers unmatched quality and reliability for your applications. Whether you're designing robotics, drones, or industrial machinery, this Motion Control IC delivers exceptional performance, efficiency, and durability. Trust in Onsemi's expertise to enhance your projects and elevate your creations to new heights. Elevate your designs with the LB1847-E today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good mechanical strength and thermal resistance, making the product durable and suitable for a wide range of operating conditions.

Power Supplies (V): 5,45

The product can operate within a wide range of power supply voltages, providing flexibility in integration and compatibility with various systems.

No. of Terminals: 28

Having a high number of terminals allows for more connectivity options and functionality, making the product versatile and capable of handling complex control requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance even in harsh environmental conditions or high-temperature applications.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the product to function effectively in cold environments or during temperature variations, increasing its usability.

Technology: BIPOLAR

Bipolar technology offers high switching speeds and precise control, making the product suitable for applications requiring fast response times and accuracy in motion control.

Technical Specifications

Motion Control ICs LB1847-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.5

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,45

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

36.5 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LB1847-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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