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LB1668M-TLM-H

Onsemi

LB1668M-TLM-H by Onsemi

LB1668M-TLM-H by Onsemi is a Motion Control IC with 14 terminals, operating at -30 to 80 °C. It features a supply voltage range of 6.4-7V, output current up to 1.5A, and Gull Wing terminal form. Ideal for Brushless DC Motor Controllers in commercial applications requiring low profile design and small footprint.

Median Price

$0.679

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$0.679

1k+ parts

$0.564

10k+ parts

$0.503

38

-

$0.679

$0.564

$0.503

Distributors (In-Stock)

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Digiode

USA . 401 parts In-Stock

1+ parts

$0.554

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-

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401

$0.554

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Chip Stock

USA . 54,000 parts In-Stock

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54,000

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Vyrian

USA . 10,515 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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Corphita

USA . 2,213 parts In-Stock

1+ parts

$0.525

100+ parts

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2,213

$0.525

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Corohmni

South Africa . 54 parts In-Stock

1+ parts

$0.583

100+ parts

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54

$0.583

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AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$9.570

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856

$9.570

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QUARKTWIN TECHNOLOGY LTD

USA . 13,531 parts In-Stock

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13,531

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TANS Electronics

Latvia . 7,691 parts In-Stock

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7,691

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SupplyDigital Components

Austria . 6,088 parts In-Stock

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Kulean Microsystems

USA . 5,894 parts In-Stock

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Problanco Electronics

Mexico . 5,544 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Metaverse IC Inc.

Canada . 838 parts In-Stock

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838

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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520

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 202 parts In-Stock

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202

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Overview

Elevate your motion control systems with the LB1668M-TLM-H by Onsemi. Crafted with precision and expertise, this compact BRUSHLESS DC MOTOR CONTROLLER offers seamless operation and enhanced performance in a variety of applications. With its innovative design and advanced technology, this Motion Control IC ensures reliable functionality and precise control. Experience the quality and reliability that only Onsemi can deliver, providing you with the value and efficiency you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection, making it suitable for various operating environments.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 6.7 V

The specified supply voltage ensures optimal performance and compatibility with other system components.

Terminal Finish: TIN BISMUTH

Tin bismuth finish enhances solderability and conductivity for reliable connections in the circuit.

Maximum Output Current: 1.5 A

A high output current rating allows for controlling higher power motors effectively, making this IC suitable for driving brushless DC motors.

Technical Specifications

Motion Control ICs LB1668M-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.7

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

6.4 V

Nominal Supply Voltage (Vsup):

6.7 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB1668M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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