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LB1663M

Onsemi

LB1663M by Onsemi

LB1663M by Onsemi is a Motion Control IC with 24 terminals in a small outline package. Operating temperature range from -30 to 80 °C, suitable for commercial extended applications. Features include bipolar technology, Gull Wing terminals, and 50mA max supply current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 28,800 parts In-Stock

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28,800

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Vyrian

USA . 1,711 parts In-Stock

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1,711

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Digiode

USA . 609 parts In-Stock

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609

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Distributors (Availability)

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SupplyDigital Components

Austria . 6,312 parts In-Stock

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6,312

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Kulean Microsystems

USA . 6,053 parts In-Stock

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6,053

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TANS Electronics

Latvia . 4,352 parts In-Stock

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4,352

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Problanco Electronics

Mexico . 2,659 parts In-Stock

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2,659

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Corphita

USA . 1,372 parts In-Stock

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1,372

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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939

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Corohmni

South Africa . 450 parts In-Stock

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450

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Overview

Unleash the power of precision and reliability with the LB1663M by Onsemi. Crafted with superior quality and expertise, this motion control IC offers unmatched performance in a wide range of applications. Elevate your projects with seamless operation and unparalleled efficiency, all while enjoying the value and benefits that Onsemi's cutting-edge technology brings to the table. Trust in the LB1663M to deliver top-notch results and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring long-term performance and reliability.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and facilitating automated assembly processes.

No. of Terminals: 24

With 24 terminals, this IC offers a wide range of connectivity options, enabling versatile application in various motion control systems.

Maximum Operating Temperature: 80 °C

High maximum operating temperature tolerance of 80 °C ensures stable performance even in demanding industrial environments with elevated temperatures.

Technology: BIPOLAR

Bipolar technology provides precise control and efficient power management, making this IC suitable for high-performance motion control applications.

Technical Specifications

Motion Control ICs LB1663M attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1663M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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