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LB1641

Onsemi

LB1641 by Onsemi

LB1641 by Onsemi is a BRUSH DC MOTOR CONTROLLER IC with 10 terminals and a supply voltage range of 7-18V. It operates b/w -25 to 75 °C, with a max output current of 1.6A. This motion control IC is ideal for applications requiring precise motor control in commercial extended temperature environments.

Median Price

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Lifecycle Status

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ComSIT Distribution GmbH

Germany . 2,600 parts In-Stock

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Vyrian

USA . 1,926 parts In-Stock

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Digiode

USA . 965 parts In-Stock

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LWI Electronics Inc

India . 418 parts In-Stock

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Cyclops Electronics Ltd

UK . 36 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

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ECAB

Sweden . 25 parts In-Stock

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LittleDiode

UK . 9 parts In-Stock

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Goldney Electronics S.L.

Spain . 6 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 3 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1 parts In-Stock

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MISTER SPROCKETS

USA . 1 parts In-Stock

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Huijzer Components

Netherlands . 1 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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S.R.D Solutions

India . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 8,268 parts In-Stock

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Kulean Microsystems

USA . 6,820 parts In-Stock

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TANS Electronics

Latvia . 6,158 parts In-Stock

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Metaverse IC Inc.

Canada . 1,744 parts In-Stock

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Corphita

USA . 1,352 parts In-Stock

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Assy Fe

Spain . 1,055 parts In-Stock

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SupplyDigital Components

Austria . 750 parts In-Stock

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Corohmni

South Africa . 233 parts In-Stock

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ChipstoGo Electronic ltd

UK . 194 parts In-Stock

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UHIMA Technologies

Türkiye . 95 parts In-Stock

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Perfect Parts

USA . 63 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 28 parts In-Stock

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Overview

Unlock the power of motion control with the LB1641 by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this brush DC motor controller offers seamless operation and precise control. Ideal for a wide range of applications, from robotics to industrial automation, the LB1641 provides unmatched reliability and performance. Experience the convenience and efficiency this product brings to your projects, delivering value and benefits that exceed expectations. Elevate your motion control needs with the LB1641 from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12 V provides a stable power source for the motion control IC, ensuring reliable performance.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, this motion control IC can handle high temperature environments without compromising its functionality.

Maximum Output Current: 1.6 A

The high maximum output current of 1.6 A allows the motion control IC to drive powerful motors efficiently.

Technical Specifications

Motion Control ICs LB1641 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 5 TO 18V SUPPLY

Other IC type:

JESD-30 Code:

R-PSIP-T10

Length:

24 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SIP

Package Equivalence Code:

SIP10,.06

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

7.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

7 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Width (mm):

3.25 mm

Trade Compliance

LB1641 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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