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TLE4205GXUMA1

Infineon Technologies

TLE4205GXUMA1 by Infineon Technologies

TLE4205GXUMA1 by Infineon is a Motion Control IC for brush DC motor control. It operates in industrial temperature range (-40 to 105°C) with max output current of 1A. With a small outline package and surface mount design, it's suitable for various motion control applications.

Median Price

$2.935

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 967 parts In-Stock

1+ parts

$1.260

100+ parts

$1.230

1k+ parts

$1.210

10k+ parts

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967

$1.260

$1.230

$1.210

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Element14

Singapore . 2,632 parts In-Stock

1+ parts

$4.610

100+ parts

$3.400

1k+ parts

$2.450

10k+ parts

$2.230

2,632

$4.610

$3.400

$2.450

$2.230

Distributors (In-Stock)

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Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$2.299

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69

$2.299

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Chip Stock

USA . 14,200 parts In-Stock

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14,200

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Vyrian

USA . 3,621 parts In-Stock

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3,621

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Digiode

USA . 831 parts In-Stock

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831

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Bastille Electronics

Australia . 870 parts In-Stock

1+ parts

$2.299

100+ parts

$2.184

1k+ parts

$2.075

10k+ parts

$2.046

870

$2.299

$2.184

$2.075

$2.046

Continental Prestige Electronics

USA . 4,602 parts In-Stock

1+ parts

$2.299

100+ parts

-

1k+ parts

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10k+ parts

$2.253

4,602

$2.299

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-

$2.253

Argo Parts USA

USA . 503 parts In-Stock

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$2.299

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503

$2.299

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Corohmni

South Africa . 163 parts In-Stock

1+ parts

$4.284

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163

$4.284

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Ampacity Inc.

Singapore . 1,302 parts In-Stock

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$4.500

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1,302

$4.500

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Semicontronic

India . 409 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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409

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$14.220

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677

$14.220

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Aztec Data Supply Inc.

USA . 32,664 parts In-Stock

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$16.060

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32,664

$16.060

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$17.226

100+ parts

$16.364

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$16.364

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2,000

$17.226

$16.364

$16.364

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Modulus Dynamics

Lithuania . 5,369 parts In-Stock

1+ parts

$20.529

100+ parts

$19.708

1k+ parts

$18.887

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5,369

$20.529

$19.708

$18.887

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Corphita

USA . 872 parts In-Stock

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872

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iodParts Technologies Inc.

India . 500 parts In-Stock

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500

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Microchip USA

USA . 141 parts In-Stock

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141

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Overview

Enhance your motion control applications with the TLE4205GXUMA1 from Infineon Technologies. This high-quality brush DC motor controller offers superior performance and reliability, thanks to its advanced technology and industrial-grade design. With a maximum output current of 1A and a wide operating temperature range, this small outline package IC is perfect for a variety of industrial and automotive applications. Experience seamless operation and precise control with the TLE4205GXUMA1, delivering value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and space.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and versatile usage in different applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows for use in both extreme cold and hot environments.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage requirement enables the IC to operate efficiently with a variety of power sources.

Maximum Output Current: 1 A

With a maximum output current of 1 A, this IC can handle a decent amount of load, making it suitable for driving motors.

Technical Specifications

Motion Control ICs TLE4205GXUMA1 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.6 mm

Trade Compliance

TLE4205GXUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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