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TLE4205GNTMA1

Infineon Technologies

TLE4205GNTMA1 by Infineon Technologies

TLE4205GNTMA1 by Infineon is a Motion Control IC for brush DC motors. It operates b/w -40 to 105°C with max output current of 1A. With small outline package and bipolar technology, it's ideal for industrial applications requiring supply voltage from 6V to 32V.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44,000 parts In-Stock

1+ parts

$1.250

100+ parts

$1.230

1k+ parts

$1.200

10k+ parts

-

44,000

$1.250

$1.230

$1.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$1.359

100+ parts

-

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-

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750

$1.359

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-

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Chip Stock

USA . 22,388 parts In-Stock

1+ parts

-

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22,388

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Vyrian

USA . 1,596 parts In-Stock

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1,596

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Digiode

USA . 347 parts In-Stock

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347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.359

100+ parts

$1.332

1k+ parts

$1.291

10k+ parts

$1.264

500

$1.359

$1.332

$1.291

$1.264

Ampacity Inc.

Singapore . 1,322 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,322

$1.500

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AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$17.663

100+ parts

-

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822

$17.663

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Modulus Dynamics

Lithuania . 2,373 parts In-Stock

1+ parts

$23.702

100+ parts

$22.754

1k+ parts

$21.806

10k+ parts

-

2,373

$23.702

$22.754

$21.806

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Perfect Parts

USA . 4,444 parts In-Stock

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4,444

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Microchip USA

USA . 1,750 parts In-Stock

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1,750

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Corphita

USA . 900 parts In-Stock

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900

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iodParts Technologies Inc.

India . 500 parts In-Stock

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500

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Overview

Experience seamless motion control like never before with the TLE4205GNTMA1 by Infineon Technologies. Crafted with precision and expertise, this motion control IC sets a new standard in the industry, offering unrivaled quality and reliability. Perfect for applications requiring precise control over brush DC motors, this small outline package delivers outstanding performance with a maximum output current of 1A. Trust in the innovation of Infineon Technologies to take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, maximizing component placement.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the IC to other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact designs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Technology: BIPOLAR

Bipolar technology offers high output current capabilities and fast switching speeds for efficient motion control.

Maximum Output Current: 1 A

A maximum output current of 1 A allows for driving various types of motors with ease.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage ensures compatibility with various power sources.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting and connections on the PCB.

Technical Specifications

Motion Control ICs TLE4205GNTMA1 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.6 mm

Trade Compliance

TLE4205GNTMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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