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TLE4729G

Infineon Technologies

TLE4729G by Infineon Technologies

TLE4729G by Infineon Technologies is a Motion Control IC with 24 terminals, operating at 5-16V. It features a max output current of 1A and uses bipolar technology for stepper motor control applications. This small outline package measures 15.6mm in length, making it suitable for compact designs requiring precise motion control.

Median Price

$2.156

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Chip1Stop

Japan . 500 parts In-Stock

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$1.990

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Verical

USA . 6 parts In-Stock

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Digiode

USA . 867 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$2.935

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Maritex

Poland . 15,419 parts In-Stock

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Chip Stock

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Bristol Electronics

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LIBRA Elektronik GmbH

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Atlantic Semiconductor

USA . 1,872 parts In-Stock

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ComSIT Distribution GmbH

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Zilex Electronics Inc.

Canada . 315 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 288 parts In-Stock

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PC Components Company LLC

USA . 267 parts In-Stock

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Kronex Distribution GmbH

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Cyclops Electronics Ltd

UK . 140 parts In-Stock

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Tectiva GmbH

Germany . 55 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$1.740

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Semicontronic

India . 6 parts In-Stock

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$1.740

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$1.696

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$1.688

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Corphita

USA . 308 parts In-Stock

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$1.782

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Component Stockers USA

USA . 5 parts In-Stock

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Argo Parts USA

USA . 4,011 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$2.876

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Continental Prestige Electronics

USA . 1,959 parts In-Stock

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Modulus Dynamics

Lithuania . 2,057 parts In-Stock

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$9.561

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$9.179

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AZTECH Wire

Italy . 675 parts In-Stock

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A-Z Elektronik GmbH

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XScomponents

USA . 2,000 parts In-Stock

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Lixinc

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Cyclops Electronics Ltd (Excess)

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Authorized Procurement Solutions

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Overview

Elevate your motion control applications with the TLE4729G by Infineon Technologies. Crafted with precision and excellence, this stepper motor controller boasts top-notch quality and reliability. Perfect for a wide range of industries, this small outline package delivers seamless performance and efficient power supplies ranging from 6V to 16V. Experience smooth operation and enhanced functionality with the TLE4729G, a versatile solution that guarantees value and innovation for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it suitable for use in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the IC onto a PCB, saving space and manufacturing costs.

Nominal Supply Voltage (Vsup): 12 V

The specified supply voltage ensures stable and reliable operation of the IC in a typical operating environment.

No. of Terminals: 24

Having a higher number of terminals allows for more connectivity options and versatility in designing circuits with this IC.

Maximum Output Current: 1 A

The high output current capability of 1 A enables the IC to drive stepper motors efficiently and effectively in various applications.

Technical Specifications

Motion Control ICs TLE4729G attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

Length:

15.6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/16

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.6 mm

Trade Compliance

TLE4729G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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