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LA6585MC-AH

Onsemi

LA6585MC-AH by Onsemi

LA6585MC-AH by Onsemi is a Motion Control IC with 12V supply voltage, 0.7A output current, and 10 terminals. Ideal for Brushless DC Motor control applications due to its bipolar technology and small outline package style. Operating temperature range from -30 °C to 90°C makes it versatile for various environments.

Median Price

$0.485

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 794 parts In-Stock

1+ parts

-

100+ parts

$0.485

1k+ parts

$0.403

10k+ parts

$0.359

794

-

$0.485

$0.403

$0.359

Distributors (In-Stock)

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Digiode

USA . 595 parts In-Stock

1+ parts

$0.378

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-

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-

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595

$0.378

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Chip Stock

USA . 24,000 parts In-Stock

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24,000

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Vyrian

USA . 10,086 parts In-Stock

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10,086

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$0.232

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-

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1

$0.232

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Corphita

USA . 922 parts In-Stock

1+ parts

$0.358

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922

$0.358

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Corohmni

South Africa . 304 parts In-Stock

1+ parts

$0.398

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304

$0.398

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Advanced Electronics

New Zealand . 400 parts In-Stock

1+ parts

$13.867

100+ parts

$12.619

1k+ parts

$11.371

10k+ parts

-

400

$13.867

$12.619

$11.371

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AZTECH Wire

Italy . 112 parts In-Stock

1+ parts

$15.060

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112

$15.060

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Kepictronics

USA . 25,810 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,704 parts In-Stock

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SupplyDigital Components

Austria . 6,272 parts In-Stock

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Problanco Electronics

Mexico . 5,270 parts In-Stock

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5,270

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 1,049 parts In-Stock

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1,049

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UHIMA Technologies

Türkiye . 921 parts In-Stock

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921

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Metaverse IC Inc.

Canada . 208 parts In-Stock

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TANS Electronics

Latvia . 156 parts In-Stock

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156

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Microchip USA

USA . 154 parts In-Stock

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154

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Overview

Enhance your motion control applications with the LA6585MC-AH by Onsemi, a top-quality manufacturer known for delivering exceptional performance and reliability. Designed for brushless DC motor control, this versatile IC offers ease of installation with its small outline and shrink pitch package style. With a wide operating temperature range and a maximum supply voltage of 14V, this product ensures seamless functionality in various environments. Upgrade your projects now and experience the value and benefits that the LA6585MC-AH brings to your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product suitable for long-term use in various environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto PCBs, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage provides a stable power source for the device, ensuring consistent and reliable performance.

No. of Terminals: 10

Having 10 terminals allows for multiple connections and interfaces, enabling versatile use in different applications.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90 °C ensures that the product can withstand heat and perform efficiently in challenging environmental conditions.

Minimum Operating Temperature: -30 °C

With a low minimum operating temperature of -30 °C, the product is suitable for use in cold environments without compromising its performance.

Maximum Output Current: 0.7 A

The high maximum output current of 0.7A allows for driving power-hungry devices effectively, making this product ideal for motor control applications.

Technical Specifications

Motion Control ICs LA6585MC-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

LA6585MC-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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