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LA6585MC-AH-M

Onsemi

LA6585MC-AH-M by Onsemi

LA6585MC-AH-M by Onsemi is a Motion Control IC with 10 terminals, operating b/w -30 to 90 °C. It supports a supply voltage range of 2.2V to 14V and offers a max output current of 0.7A. Ideal for applications requiring Brushless DC Motor control in compact spaces due to its small outline package style.

Median Price

$0.491

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,893 parts In-Stock

1+ parts

-

100+ parts

$0.491

1k+ parts

$0.408

10k+ parts

$0.363

2,893

-

$0.491

$0.408

$0.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 255 parts In-Stock

1+ parts

$0.383

100+ parts

-

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-

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255

$0.383

-

-

-

Vyrian

USA . 10,830 parts In-Stock

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10,830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 931 parts In-Stock

1+ parts

$0.363

100+ parts

-

1k+ parts

-

10k+ parts

-

931

$0.363

-

-

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Corohmni

South Africa . 421 parts In-Stock

1+ parts

$0.403

100+ parts

-

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421

$0.403

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-

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AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$9.770

100+ parts

-

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454

$9.770

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QUARKTWIN TECHNOLOGY LTD

USA . 17,393 parts In-Stock

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17,393

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Problanco Electronics

Mexico . 7,147 parts In-Stock

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7,147

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SupplyDigital Components

Austria . 6,383 parts In-Stock

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6,383

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Kulean Microsystems

USA . 4,313 parts In-Stock

1+ parts

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4,313

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TANS Electronics

Latvia . 538 parts In-Stock

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538

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Microchip USA

USA . 178 parts In-Stock

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178

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UHIMA Technologies

Türkiye . 52 parts In-Stock

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52

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Overview

Experience seamless motion control with the LA6585MC-AH-M by Onsemi, a leading manufacturer known for top-notch quality and reliability. This Motion Control IC offers unparalleled performance in various applications, providing customers with precise and efficient control over their systems. Benefit from its sleek design, easy installation, and exceptional value, making it the perfect choice for your next project. Upgrade your motion control experience with the LA6585MC-AH-M and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs during production.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V provides a stable power source for the motion control IC, ensuring consistent performance.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90 °C, this motion control IC can withstand a wide range of environmental conditions, making it suitable for various applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures that the motion control IC can operate effectively even in cold environments, increasing its versatility.

Maximum Supply Current (Isup): 9 mA

The low maximum supply current of 9mA indicates that the IC is energy-efficient, consuming minimal power for operation.

Technical Specifications

Motion Control ICs LA6585MC-AH-M attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

LA6585MC-AH-M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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